Steering Committee
Chairman:
Prof. Paul Svasta, Ph.D., “Politehnica” University of Bucharest, Romania
Co-Chairman:
Prof. Dan Pitică, Ph.D., Technical University of Cluj-Napoca, Romania
Members:
Prof. Dorel Aiordăchioaie, Ph.D., University of “Dunărea de Jos” Galaţi, Romania
Alexandru Borcea, MBA, Romanian Association for Electronic and Software Industry
Assoc. Prof. Attila Buchman, Ph.D., University of Baia Mare, Romania
Prof. Vlad Cehan, , Ph.D., “Gh. Asachi” Technical University, Iaşi, Romania
Prof. Laurenţiu Frângu, Ph.D., University of “Dunărea de Jos” Galaţi, Romania
Rosemari Fuica, Ph.D. Association for Promoting Electronic Technology, Romania
Prof. Aurel Gontean, Ph.D., “Politehnica” University of Timişoara, Romania
Prof. Ioan Liţă, Ph.D., University of Piteşti, Romania
Prof. Ioan P. Mihu Ph.D., “Lucian Blaga” University of Sibiu, Romania
Assoc. Prof. Gheorghe Pană, Ph.D., “Transilvania“ University of Braşov, Romania
Prof. Valentin Popa, Ph.D., “Ştefan cel Mare” University of Suceava, Romania
Prof. Dorina Purcaru, University of Craiova, Romania
Prof. Paul Şchiopu Ph.D. “Politehnica” University of Bucharest, Romania
Assoc. Prof. Adrian Tulbure, Ph.D., “1 Decembrie 1918” University of Alba Iulia, Romania
Gabriel Vlăduţ, Ph.D., Romanian Association for Technological Transfer and Innovation

Technical Committee
Chairman:
Assoc. Prof. Norocel Codreanu, Ph.D., “Politehnica” University of Bucharest, Romania
Co-Chairman:
Assist.Eng. Emanoil Toma, “Lucian Blaga” University of Sibiu, Romania
Members:
Eng. Constantin Barabaşa, Ph.D., “Gh. Asachi” Technical University of Iaşi, Romania
Eng. Marius Carp, Ph.D., “Transilvania” University of Braşov, Romania
Assoc. Prof. Emilian Ceuca, Ph.D., “1 Decembrie 1918” University of Alba Iulia, Romania
Assist Eng. Bogdan Cioc, University of Piteşti, Romania
Assoc. Prof. Eugen Coca, Ph.D., “Ştefan cel Mare” University of Suceava, Romania
Assist. Eng. Cristinel Crăciun, University of “Dunărea de Jos” Galaţi, Romania
Assist Eng. Silviu Epure, University of “Dunărea de Jos” Galaţi, Romania
Assoc. Prof. Tecla Goraş, Ph.D., “Gh. Asachi” Technical University of Iaşi, Romania
Assist Eng. Claudiu Lung, University of Baia Mare, Romania
Lect. Eng. Alin Mazăre, Ph.D., University of Piteşti, Romania
Eng. Cătălin Negrea, “Politehnica” University of Timişoara, Romania
Lect. Maximilian Nicolae, Ph.D, “Politehnica” University of Bucharest, Romania
Lect. Eng. Marius Rangu, Ph.D., “Politehnica” University of Timişoara, Romania
Assist.Eng. Liviu Viman, Ph.D., Technical University of Cluj-Napoca, Romania

European Consultants:
Prof. Zsolt Illyefalvi-Vitez, Ph.D, University of Technology and Economics, Budapest, Hungary
Prof. Pavel Mach, Ph.D., Czech Technical University in Prague, Czech Republic
Prof. Alena Pietrikova, Ph.D. Technological University of Kosice, Slovak Republic
Prof. Jerzy Potencki Ph.D., Rzeszow University of Technology, Poland
Prof. Nihal Sinnadurai, Ph.D., IMAPS Europe, ELC President
Habil Heinz Wohlrabe, Ph.D., Technical University of Dresden

Industrial Advisor Committee
Chairman:
Cosmin Moisa, Continental Automotive, Timişoara
Co- Chairman:
Assoc. Prof. Gabriel Chindriş, Ph.D., Technical University of Cluj-Napoca, Romania
Members:
Cosmin Frecia, Kuhnke Production Romania SRL, Romania
Jan Galcescu, Epsicom SRL, Craiova
Florin Hurgoi, National Instruments Romania, Cluj-Napoca
Zsolt Mathe, Tehnologistic SRL, Cluj-Napoca
Gabriel Neagu, Electronica Azi, Bucharest
Mugurel Niculescu, Sytron Technologies Overseas, Bucharest
Flaviu Nistor, Continental Automotive System SRL, Sibiu
Mihai Petculescu, Maquardt Schaltsystems SCS, Sibiu
Emil Popa, Wenglor Electronic SRL, Sibiu
Mariana Poparlan, Simea, Sibiu
Mihai Savu, Samway, Bucharest
Carol Stefani, Kromberg & Schubert Romania Me SRL, Sibiu
Emilian Stoica, Simea, Sibiu

Advertising Committee
Chairman:
Marian VLADESCU, POLITEHNICA University of Bucureşti
Co-Chairman:
Alin MAZĂRE, University of Pitesti
Members:
Andreea BONEA, POLITEHNICA University of Bucureşti
George CRACIUNAS, Technical University “Gh. Asachi” of Iaşi
Bianca DEORDICA, „Transilvania” University of Braşov
Anisia FLORESCU, DUNAREA DE JOS GALATI UNIVERSITY
Rajmond JANO, Technical University of Cluj-Napoca
Cristina MARGHESCU, POLITEHNICA University of Bucureşti
Adrian PETRARIU, Stefan cel Mare University of Suceava
Silvana Popescu, Politehnica University of Timisoara

Student Committee
Chairman:
Andreea Bonea, IEEE-CPMT “Politehnica” University of Bucharest SBC Chair
Members:
Bogdan Anton
Andreea Brodeală
Cristina Marghescu
Bogdan Mihăilescu
Mihaela Pantazică

Local Organizing Committee
Chairman:
Prof. Liviu Rosca Ph.D., Dean of Engineering Faculty, “Lucian Blaga” University of Sibiu, Romania
Co-Chairman:
Prof. Daniel Volovici Ph.D., Head of Computer and Electric Engineering Department, “Lucian Blaga” University of Sibiu, Romania
Prof. Ioan P. Mihu Ph.D., “Lucian Blaga” University of Sibiu, Romania
Members:
Dorin Cismasiu Ph.D.
Tudor Dachin
Mariana Fleaca
Beriliu Ilie Ph.D.
Ciprian Ionescu, Ph.D.
Delia Lepădatu
Mariana Pătuleanu
Ioan Plotog, Ph.D
Florentina Răduţă
Adina Ţapu

download the TIE2012 Regulations (.doc file)

INTERCONNECTION TECHNIQUES IN ELECTRONICS

‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST ‑

PURPOSE AND OBJECTIVES

This student technical event has the main purpose of evaluating the level of knowledge gained by students in the field of technological computer aided design (CAE-CAD-CAM) of electronic modules, with focus to both THT (through hole technology) and SMT (surface mount technology) technologies.

The contest is based on the knowledge obtained at the courses in electronics regarding the design and manufacturing of analogue, digital and mixed electronic modules, as well as on the advanced knowledge of designing PCB interconnection structures (printed circuit boards) according to the IPC (Association Connecting Electronics Industries) standards recognized by the electronics industry worldwide.

Aim of the contest:

• Arousing the students’ interest in the electronic packaging issues and PCB interconnection structures;
• Evaluating of knowledge in a competitive environment;
• Certifying by industry, with the support of the IAC (Industrial  Adviser Committee), of competitors’ CAD skills;
• Supporting the electronics industry with professional human resources.

Objectives:

• Familiarizing the students with the necessary activities for designing the electronic projects of the analogue, digital and mixed modules and the PCB interconnection structures, in order to meet the demands required by the project/product specifications;
• Reaching a high level of professionalism in using CAD software systems in this field;
• Rising the awareness of the electronics industry on the existing human resources and realizing a strong partnership between academia and industry;
• Increasing of job demands for the career of electronics engineer from today students and of job offers from the industrial environment.

The organization

The international student contest “Interconnection Techniques in Electronics (TIE)” is coordinated by “Politehnica” University of Bucharest, Center for Technological Electronics and Interconnection Techniques (UPB-CETTI) and continuously supported by IEEE CPMT HU&RO Joint Chapter. The event is yearly organised, in an itinerant way, by an university  member of the EPETRUN consortium and network (Electronic Packaging Education Training and Research University Network), being also opened to all European universities interested in education and training in the field  of electronic packaging.

The contest is supervised by five committees:

1. Steering Committee (SC);
2. Technical Committee (TC);
3. Local Committee (LC);
4. Industrial  Adviser Committee (IAC);
5. Public Relations Committee (PRC).

In the above mentioned committees take part representatives of EPETRUN, European universities, specialists from industry and members of non-guvernamental organizations involved in electronics. These committees take care of all technical and organisational aspects of the contest and of the whole TIE event.

The contest has two stages:

1. local stage (which takes place in each university centre interested to participate to TIE);
2. final stage (which takes place in an university centre selected by the steering committee at least one year before the contest).

topics *

1. CAD design of electronic circuits (SCM, SCH);
2. Creation of virtual components (parts);
3. SCM post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation);
4. CAD design of on-board interconnection structures (PCB);
5. Creation of PCB footprints;
6. Professional inter-tool communication techniques between SCM and PCB environments;
7. PCB post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation and manufacturing);
8. Standardization elements for PCB design;
9. Elements of analogue, digital and mixed design;
10. Elements of signal integrity, power integrity and electromagnetic compatibility at the PCB level.

* See on www.tie.ro all the technical topics and issues requested by the TC.

on-going regulations

1. Each university centre will be allowed to participate at the final stage with 4 students, 3 accepted competitors (3 bachelor students + 0 master students or 2 bachelor students + 1 master student) and 1 reserve (student placed in the local stage ranking after the first three), possible to participate in case other universities will not be able to participate or will participate with fewer number of competitors. The organizer will announce at least with 1 week in advance the status of the “reserve students”;
2. Any student can apply at the local stage of the contest if he/she proves he/she follows the courses of an accredited university.
3. The organization of the local stage is under the attributions of the universities involved in EPETRUN and other European universities.
4. The lists of qualified students for the final stage will be sent to the LC of the organizing university at least a two weeks before the final stage starts, according to the demands.
5. The amount of design time for the local stage is depending on local rules of the organizing university. For the final stage the design time is 240 minutes.
6. It will be mandatory for each student/competitor to participate with all the necessary hardware & software resources, in order to take part at the contest; the student/university has to prove the existence of the license for the CAD system used in the contest. The organizers will not provide any licensed software to the competitors, their main task being to manage the TIE contest and the whole scientific event around it.
7.  During the contest, the student can use her/his own documentation, paper-based or in electronic format. The draft papers will be provided by the LC/TC.
8. The on-going contest regulations can be presented to participants at the beginning of the contest.
9. During the contest, the students are not allowed to discuss between them, to ask for explanations from another competitor regarding some contest issues, to borrow objects or personal documents. During the contest, the only explanations they can ask are from the officials of LC and/or TC.
10. The contest will have an official fixed “pre-time” of 30 minutes, in which the competitors will study deeply the subjects and will ask questions; after handing-in the subjects, the students will use these 30 minutes to study the contest subjects without making any design activity on the computer and/or writing down notes and calculus;
11. In case of a technical problem, the student has to announce as soon as possible the situation to the officials of LC and/or TC present in the contest hall.
12. The students could benefit by the extension of the contest design time in certain conditions: copy of folders, breakdown of the workstation and software blocking. Any other situations will not be accepted for the extension of the official contest time.
13. The evaluation at the local stage is done by two officials together with the student who solved the subject. If the student is not present when the evaluation activity starts, he/she will be called when the evaluation session of his/her group ends. If he/she is still not present, his/her subject will be evaluated in his/her absence.
14. The evaluation at the final stage is done by two officials (from TC and IAC) together with the student who has solved the subject. If the student is not present when the evaluation activity starts, he/she will be called later or at the end of the evaluation session. If he/she is still not present, the subject will be evaluated in his/her absence, but in the presence of a witness student from the same university centre.
15. The evaluation of the subjects at the final stage is public.
16. The students who participate at the final stage will be awarded with diplomas and prizes: three prizes and five mentions.
17. Additionally, IAC will award the best ranked students with “PCB Designer” certificates recognized by the electronics industry.
18. The first prize winner is not allowed to participate at the future editions of the TIE contest.
19. The students who are not present at the contest and who are on the contest list will be referred to as “not present”, and those who leave before the contest time expires will be referred to as “abandon”.
20. The contest rules can be found on the web-page of the contest (www.tie.ro), in English and Romanian, and on the web-pages of the EPETRUN university network, depending on the specific of their web-pages.
21. Any change in the present document will be announced to all the universities participating at the TIE contest immediately after the new version was released.

Rev: December 13, 2011

Workshop

„UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES”

26 April 2012

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging.

	Universitatea „1 Decembrie 1918” Alba Iulia Registration deadline: 23 martie 2012 Local stage: 26 martie 2012 http://www.uab.ro/infostud/index.php Contact: eceuca@uab.ro
	Universitatea Transilvania din Braşov Registration deadline: 29 februarie 2012 Local stage: 30 martie 2012 http://bestbrasov.ro/tie/ Contact: gheorghe.pana@unitbv.ro
	Universitatea Politehnica din Bucureşti Termen limita pentru înscrieri: 30 martie 2012 Local stage: 5/6 aprilie 2012 Contact: norocel.codreanu@cetti.ro
	Universitatea Tehnică din Cluj-Napoca Faza locală: 14 Martie 2012 http://etti.utcluj.ro/evenimente.php Contact: Liviu.Viman@ael.utcluj.ro sau Rajmond.Jano@ael.utcluj.ro
	Universitatea Tehnică “Gh.Asachi” din Iaşi Faza locală: 7 aprilie 2012 http://electrostudis.ro/oportunitati/categorii/concursuri/2040-concurs-tehnici-de-interconectare-in-electronic-editia-xxi.html Contact: tgoras@etti.tuiasi.ro
	Universitatea “Ştefan cel Mare” Suceava Faza locală: 23 martie 2012 Termen de înscriere: 2 martie 2012
	Universitatea din Piteşti Faza locala: 17 Martie http://www.upitmedia.ro/index.php/unctr/concurs-profesional-studenesc-tie-2012.html Persoană de contact şl.dr.ing. Alin MAZĂRE

Date: Thursday 5th of April 2012

Time: 10:00 a.m.

Location: B302

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging.

Organizers for the Bucharest local stage:

Politehnica University of Bucharest Electronics, Telecommunications and Information Technology Faculty Center of Technological Electronics and Interconnection Techniques

Open the TIE2012 Program Brochure

TIE 2012 scale 21 mai 2012
TIE 2012 subject 21 mai 2012

Datasheets
D1,D2,D3,D4,D5,D6
LCD1_specs
Q1,Q2,Q3,Q4,Q5,Q6
RELAY_specs
SW1,SW2,SW3,SW4_pushbutton
U1_LQFP_48
U1_MC9S08LL16
U2_MC9S08JS16
Y1_TC38
Y2_ACHL (8 DIP)

Campania de constientizare  eSkills Week 2012 a fost lansata oficial la Bruxelles  in 13 decembrie  2011 in prezenta  reprezentantilor Comisiei europene,  ai  industriei ICT,  ai consortiului coordonator al campaniei  –
Digitaleurope si European  Schoolnet  –  si ai organizatiilor coordonatoare din cele 31 de tari participante la campanie.

Asociatia producatorilor si distribuitorilor de echipamente de tehnologia informatiei si comunicatiilor (APDETIC ) va coordona toate activitatile desfasurate in Romania in cadrul acestei campanii in  perioada  ianuarie-mai 2012 impreuna cu partenerii sai institutionali – MCSI,  corporatisti  –  Microsoft, IBM, Intel, HP  sau  non-profit  EOS, Junior Achivement, ECOTIC,  Biblionet,  Ateliere fara frontiere.
Ambasadorul  eSkills Week 2012  este  Varujan  Pambuccian.

Prima editie  eSkills Week,  desfasurata in 2010, a inclus la nivel european 1.163 de evenimente si activitati online si offline care au contribuit la constientizarea importantei crescande a aptitudinilor digitale in viata si cariera cetatenilor europeni.

In cadrul primei editii,  Romania s-a clasat intre primele tari ca numar de participanti si, nu in ultimul rand, in randul premiantilor, ca si castigatoare a Premiului pentru antreprenoriat si competente digitale,  adjudecat de doi studenti ieseni pentru proiectul Green Cell Charger.

Obiectivele declarate ale campaniei eSkills Week 2012 sunt cresterea interesului europenilor fata de tehnologia informatiei,  dezvoltarea aptitudinilor digitale in randul tuturor categoriilor sociale  si atragerea tinerilor spre cariere in sectorul ICT.
Oportunitatile  oferite  de tehnologia informatiei si comunicatiilor,  de cercetarea si dezvoltarea  secolului XX I sunt determinante pentru crearea unei forte de munca moderne, competitive.
eSkills Week 2012 este o campanie axata pe ideea de a arata oamenilor modul in care pot dobandi aptitudini noi si locuri de munca in era digitala.  Asa cum arata Dr. Erkki Ormala, Presedintele  Digitaleurope,  «intreprinderile mici si mijlocii se pot dezvolta numai prin utilizarea resurselor umane  inalt calificate. Aptitudinile digitale incurajeaza inovatia si spiritul intreprinzator.  Pur si simplu nu putem supraestima rolul tehnologiei digitale in crearea de noi locuri de munca in viitor ».
In conditiile in care datele oferite de IDC estimeaza ca 90% din totalul locurilor de munca vor solicita cel putin nivelul de baza de aptitudini digitale la orizontul anului 2015, campania eSkills 2012 isi propune sa evidentieze oportunitatile care stau la indemana tuturor in domeniul educatiei,  al dezvoltarii profesionale si al locurilor de munca si sa demonstreze importanta fundamentala a ICT in viata si cariera europenilor.

APDETIC urmareste sa deruleze,  impreuna cu partenerii,  pe parcursul celor cinci luni ale campaniei eSkills Week 2012 o serie de activitati si evenimente cum ar fi :   conferinte si seminarii, concursuri online, vizite ale tinerilor la sediul unor mari companii  din sectorul IT, mediatizarea competitiei paneuropene Project Passion (http://eskills-week.ec.europa.eu/projectpassion).

APDETIC Romania
www.asociatiait.ro