EVENT COMMITTEES TIE 2022

Steering Committee

General Chair:

Paul SVASTA, Politehnica University of Bucharest, APTE

General Academic Co-Chair:

Dan PITICĂ, Technical University of Cluj-Napoca

General Industrial Co-Chair:

Cosmin MOISĂ, Continental Automotive, Timişoara

 
TIE 2021 Chair:

Liviu VIMAN, Technical University of Cluj-Napoca

TIE 2021 Co-Chair:

Gabriel CHINDRIŞ, Technical University of Cluj-Napoca


Steering Committee
Members:

Dorel AIORDĂCHIOAIE, Dunărea de Jos University of Galaţi
Ilie BERILIU, Lucian Blaga University of Sibiu
Alexandru BORCEA, Romanian Association for Electronic and Software Industry
Radu BOZOMITU, Gh. Asachi Technical University of Iaşi
Vlad CEHAN, Gh. Asachi Technical University of Iaşi
Gabriel CHINDRIŞ, Technical University of Cluj-Napoca
Eugen COCA, Ştefan cel Mare University of Suceava
Elena DOICARU, University of Craiova
Aurelia FLOREA, Human Resources Manager, Miele Brasov
Aurel GONTEAN, Politehnica University of Timişoara
Tecla GORAŞ, Gh. Asachi Technical University of Iaşi
Mihaela HNATIUC, Maritime University of Constanţa
Ciprian IONESCU, University Politehnica of Bucharest
Ioan LIŢĂ, University of Piteşti
Bogdan MIHĂILESCU, University Politehnica of Bucharest, APTE
Viorel NICOLAU, Dunărea de Jos University of Galaţi
Cristina OPREA, Tensor srl
Gheorghe PANĂ, Transilvania University of Braşov
Daniela TĂRNICERIU, Gh. Asachi Technical University of Iaşi
Daniel TRIP, University of Oradea
Adrian TULBURE, 1 Decembrie 1918 University of Alba Iulia
Gabriel VLĂDUŢ, Romanian Association for Technological Transfer and Innovation


International Advisory Body:

Karlheinz BOCK, TU Dresden, Electronics Packaging Lab IAVT, Dresden, Germany
Detlef BONFERT, Fraunhofer EMFT, Munich Germany
Joseph FJELSTAD, CEO of Verdant Electronics, USA
Zsolt ILLYEFALVI-VITEZ, University of Technology and Economics, Budapest, Hungary
Pavel MACH, Czech Technical University in Prague, Czech Republic
Alain MICHEL, ANSYS France
Jim MORRIS, Portland State University, Oregon USA
Andy SHAUGHNESSY, Managing Editor of The PCB Design Magazine and PCBDesign007, USA
Nihal SINNADURAI, IMAPS ELC Past President, U.K.
Heinz WOHLRABE, TU Dresden, Germany
Klaus-Jürgen WOLTER, TU Dresden, Germany


Technical Committee – Academic Trainers

Chairman:

Norocel CODREANU, Politehnica University of Bucharest

Co-Chairman:

Liviu VIMAN, Technical University of Cluj-Napoca


Members:

Mihaela ANDREI, Dunărea de Jos University of Galaţi
Constantin BARABAŞA, Gh. Asachi Technical University of Iaşi
Marius CARP, Transilvania University of Braşov
Emilian CEUCA, 1 Decembrie 1918 University of Alba Iulia
Cătălin CONSTANTINESCU, University of Craiova
Silviu EPURE, Dunărea de Jos University of Galaţi
Tecla GORAŞ, Gh. Asachi Technical University of Iaşi
Septimiu LICĂ, Politehnica University of Timişoara
Claudiu LUNG, University of Baia Mare
Mihai DĂRĂBAN, Technical University of Cluj-Napoca
Adrian TĂUT, Technical University of Cluj-Napoca
Raul FIZEȘAN, Technical University of Cluj-Napoca
Alin Gheorghiță MAZĂRE, University of Piteşti
Maximilian NICOLAE, University Politehnica of Bucharest
Mihaela PANTAZICĂ, University Politehnica of Bucharest
Mirel PĂUN, Maritime University of Constanţa
Adrian PETRARIU, Ştefan cel Mare University of Suceava
Adrian ŞCHIOP, University of Oradea
Emanoil TOMA, Lucian Blaga University of Sibiu


Industrial Committee

Chairman:

Mihai FEDOREAC, Continental Automotive, Timişoara


Industrial Co- Chair:

Bogdan POPESCU, MICROCHIP Technology, Bucureşti

Members:

Alexandru AMARIEI, Continental Engineering Services, Timişoara
Gheorghe AMARIEI, Continental Engineering Services, Timişoara
Adrian BOSTAN, MICROCHIP Technology, Bucureşti
Aurelian BOTĂU, Continental Automotive, Timişoara
Valentin Cătălin BURCIU, Draexlmaier Romania
Mihai BURGHEAUA, Continental Automotive, Iaşi
Iulian BUŞU, LUMPED Elements, Bucureşti
Mihai CENUȘĂ, Continental Automotive, Iaşi
Alin GHENESCU, Continental Automotive Systems, Sibiu
Nicolae GROSS, Continental Automotive Systems, Sibiu
Florin HEREDEU, Plexus, Oradea
Florin Bogdan MARANCIUC, Continental Automotive Systems, Sibiu
Ionuţ Alexandru MARIN, Continental Automotive Systems, Sibiu
Andrei NICORAŞ, Plexus, Oradea
Cosmin OBREJA, Vitesco Technologies Engineering Romania
Andras PARANICI, Vitesco Technologies Engineering Romania
Bogdan PICĂ, NTT DATA Romania, Cluj
Mariana POPÂRLAN, Vitesco Technologies Engineering, Sibiu
Alexandru Gheorghiță RĂCHERU, Continental Automotive, Sibiu
Csaba TĂRCEAN, Continental Engineering Services, Timişoara
Bogdan Iulian TELEGARIU, Vitesco Technologies Engineering, Sibiu
Corneliu TOMA, Digitech SRL, Bucureşti
Mihai VIDRAŞCU, Autonomous Flight Technology, Bucureşti
Radu VOINA, KEYTEK Innovation, Alba Iulia

IEEE EPS Student Chapters Support Committee

Chair: Alin GRAMA, IEEE-EPS, Technical University of Cluj-Napoca, SBC Chair

Co-Chair: Mădălin MOISE, IEEE-EPS, University Politehnica of Bucharest

Members:

Andreea DUMITRAȘCU, University Politehnica of Bucharest
Valentina DUMITRAȘCU, University Politehnica of Bucharest
Alina MARCU, University Politehnica of Bucharest
Daniela PAVEL, University Politehnica of Bucharest
Elena STETCO, Technical University of Cluj-Napoca


Technical secretariat

Chair: Delia LEPĂDATU, University Politehnica of Bucharest

Co-Chair:  Ana Maria CHIRILĂ, Continental Automotive, Timișoara

Members:

Cristina LEPĂDATU, Association for Promoting Electronic Technology Bucharest
Bogdan MIHĂILESCU, Association for Promoting Electronic Technology Bucharest
Maria PĂTULEANU, University Politehnica of Bucharest
Florentina STĂLINESCU, Association for Promoting Electronic Technology Bucharest
Adelina ILIES, Technical University of Cluj-Napoca, Romania


TIE
Plus Steering Committee

Chairman:

Cătălin NEGREA, Continental Automotive, Timişoara

Co-Chairman:

Marcel MANOFU, Continental Automotive, Timişoara, Romania

Members:

Norocel CODREANU, University Politehnica of Bucharest
Cosmin MOISĂ, Continental Automotive, Timişoara
Dan PITICĂ, Technical University of Cluj-Napoca
Paul SVASTA, University Politehnica of Bucharest

TIEPlus Organizing Committee

Coordinator: Marcel MANOFU, Continental Automotive, Timişoara

Norocel CODREANU, University Politehnica of Bucharest
Mihai DĂRĂBAN, Technical University of Cluj-Napoca, Romania
Bogdan MIHĂILESCU, Association for Promoting Electronic Technology
Andreea-Luminiţa TASNADI, Continental Automotive, Timişoara
Radu VOINA, Principal Engineer, Keytek, Alba Iulia, Romania

 

TIEPlus Technical Committee Members

Mihai BURGHEAUA, Layout Engineer, Continental-OSRAM, Iaşi
Norocel CODREANU, University Politehnica of Bucharest
Danilo Di FEBO, Business Development, CST, Italy
Markus LAUDIEN, Lead Application Engineer, ANSYS, Germany
Marcel MANOFU, SI/PI Principal Eng., Continental Automotive, Timişoara
Răzvan NEAG, SI/PI Eng., Continental Engineering Services, Timişoara
Cătălin NEGREA, Continental Automotive, Timişoara
Camelia STOICA, EBU Technical Services, INAS, Craiova
Roxana VLĂDUȚĂ, SI Engineer, eSilicon, București
Radu VOINA, Digilent, Cluj-Napoca

TIEPlus 2021 Registered Participants: TBD

 

 TIEPlus University Licensing Sponsors: