Technologies of Interconnections in Electronics
The 33rd Edition,
IN PERSON in Sibiu, ROMANIA
24th-27th APRIL 2024 6 topics: TIE-E & TIE-E+ & TIE-M & TIE-M+ & TIE-T+ &
TIE-µ premiere
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TIE 2024 CLASSIFICATION
April 29, 2024TIE 2024 Events CLASSIFICATION
TIE-E | TIE-Eplus | TIE-Tplus | TIE-µ | TIE-M | TIE-MplusTIE – M Concept
April 22, 2024TIE M-Mechanical is a CAD Design Challenge that aims to assess students’ proficiency in computer-aided design (CAD) for mechanical components, with a focus on electronic packaging and electro-mechanical assembly.
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TIE µ Committees
April 19, 2024Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing CommitteeTIE Tplus Committees
April 19, 2024Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee -
TIE E Committees
April 19, 2024Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing CommitteeTIE 2024 – BROCHURE AND ADVANCED PROGRAMME
April 18, 2024TIE 2024 – BROCHURE AND ADVANCED PROGRAMME
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TIE 2024 – Recommendations for accommodation
April 16, 2024Venue for TIE & TIEplus & TIE M & TIE-M plus & TIEu 2024 and Students Accomodation
TIE – M Plus Concept
April 16, 2024TIE-Mplus focuses on structural and TIE-Tplus on thermal management analysis of electronic packaging. The contest provides students with a comprehensive electronics development experience concerning structural integrity aspects.
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TIE u (micro) Concept
March 27, 2024TIE 2024 introduces a new topic – TIE-μ, which is addressing important subjects such as advanced packaging, 2.5D/3D integration and chiplets
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EVENT COMMITTEES TIE 2024
March 20, 2024Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee -
TIE 2024 PARTNERS – SPONSORS – TECHNICAL SPONSORS
February 23, 2024Be a SPONSOR! | Pachete de sponsorizare TIE | Sponsorship packages TIE | Partners and Technical Sponsors | Platinum and Gold Sponsors
TIE_M Plus 2024 PROMOTIONAL POSTER
February 23, 2024TIE_Mplus 2024 Second Edition & Registration LINK | Supported by FIMM
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EVENT COMMITTEES TIE-M & TIE-M Plus 2024
February 23, 2024TIE-M & TIE-M Plus 2024 Steering Committee Members
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TIE 2024 events Venue for Students
January 18, 2024Venue for TIE & TIEplus & TIE M & TIE-M plus & TIEu 2024 and Students Accomodation
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TIE-E Contest – Extended technical and scientific references
January 18, 2024Recommended Standards | Books | References
What Design Tool to use for TIE -E Contest
January 18, 2024Design Tools Recommendation for Participation to TIE Professional Student Design Contest
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TIE-E Contest Regulation
January 18, 2024‑ PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑ Pending updating
TIE-E Concept
January 18, 2024The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.