The Electronic Week of Electronics Packaging Community The 33rd Edition,
IN PERSON in Sibiu, ROMANIA
24th-27th APRIL 2024
6 events: TIE & TIEplus & TIE-M & TIE-M plus & TIE-T plus & TIE-u (micro) premiere

Lucian Blaga University of Sibiu National University of Science and Technology Politehnica of Bucharest Faculty of Electronics, Telecommunications and Information Tehnology Faculty of Mechanical Engineering and Mechatronics Association for Promoting Electronics Packaging Center of Electronics Technology and Interconnection Techniques

TIE 2024

Sibiu, Romania
23rd-26th APRIL 2024