The Electronic Week of Electronics Packaging Community The 32nd Edition,
IN PERSON in Craiova, ROMANIA
18th-22th OCTOBER 2023 2 events: TIE & IEEE Symposium SIITME
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TIE 2023 CLASSIFICATION
November 9, 2023Model of Certificate of Competence in PCB design Industrial Advisor Committee of TIE 2023 would like to congratulate all participants. Position Contestant P I Vasilache Cristian P II Panait Mihai Vlăduț P III Barbu Albert – Patric M I Cristea Teodor Andrei M II
TIE 2023 & TIE M Venue for Students
October 14, 2023Venue for TIE & TIE M 2023 and Students Accomodation
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ELECTRONIC WEEK 2023 – BROCHURE AND ADVANCED PROGRAMME
October 9, 2023updated 09th of October 2023 Electronic Week 2023 – Brochure and Advanced Programme [Download PDF]
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Electronic Week 2023 – Program
October 2, 2023PreliminaryProgramme for the ELECTRONIC WEEK 2023 – TIE (TIEplus), TIE M, IEEE SBC Summit and SIITME 2023 events |
EVENT COMMITTEES TIE 2023
September 22, 2023Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee -
TIE Contest – Extended technical and scientific references
September 22, 2023Standards | Books | References
What Design Tool to use for TIE Contest
September 22, 2023Design Tools Recommendation for Participation to TIE Professional Student Design Contest
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TIE Contest Regulation
September 22, 2023‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑
TIE Concept
September 22, 2023The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.