The Electronic Week of Electronics Packaging Community The 32nd Edition,
IN PERSON in Craiova, ROMANIA
18th-22th OCTOBER 2023 2 events: TIE & IEEE Symposium SIITME
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EVENT COMMITTEES TIE 2023
September 22, 2023Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing CommitteeTIE Contest – Extended technical and scientific references
September 22, 2023Standards | Books | References
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What Design Tool to use for TIE Contest
September 22, 2023Design Tools Recommendation for Participation to TIE Professional Student Design Contest
TIE Contest Regulation
September 22, 2023‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑
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TIE Concept
September 22, 2023The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.