The Electronic Week of Electronics Packaging Community The 32nd Edition,
IN PERSON in Craiova, ROMANIA
18th-22th OCTOBER 2023
2 events: TIE & IEEE Symposium SIITME

Faculty of Electronics, Teleccomunications and Information Technology National University of Science and Technology Politehnica of Bucharest Faculty of Mechanical Engineering and Mechatronics Center of Electronics Technology and Interconnection Techniques

TIE 2023

Craiova, Romania
21st October 2023

  • EVENT COMMITTEES TIE 2023

     September 22, 2023

    Steering Committee Members
    Technical Committee
    Programme Committee
    International Advisory Body
    Industrial Advisor Committee
    IEEE EPS Student Chapters Support Committee
    Local Organizing Committee

    TIE Contest – Extended technical and scientific references

     September 22, 2023

    Standards | Books | References

  • What Design Tool to use for TIE Contest

     September 22, 2023

    Design Tools Recommendation for Participation to TIE Professional Student Design Contest

    TIE Contest Regulation

     September 22, 2023

    ‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑

  • TIE Concept

     September 22, 2023

    The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.