The Electronic Week of Electronics Packaging Community The 31st Edition,
IN PERSON in Bucharest, ROMANIA
24th-29th OCTOBER 2022
2 events: TIE & IEEE Symposium SIITME

University Politehnica of Bucharest Faculty of Mechanical Engineering and Mechatronics Center of Electronics Technology and Interconnection Techniques Faculty of Electronics, Teleccomunications and Information Technology

TIE 2022

Bucharest, Romania
24th-29th October 2022