The Electronic Week of Electronics Packaging Community The 32^nd Edition,
IN PERSON in Craiova, ROMANIA
18^th-22^th OCTOBER 2023
2 events: TIE & IEEE Symposium SIITME

Model of Certificate of Competence in PCB design   Industrial Advisor Committee of TIE 2023 would like to congratulate all participants.   Position Contestant P I Vasilache Cristian         P II Panait Mihai Vlăduț   P III Barbu Albert – Patric M I Cristea Teodor Andrei         M II

Venue for TIE & TIE M 2023 and Students Accomodation

updated 09th of October 2023 Electronic Week 2023 – Brochure and Advanced Programme [Download PDF]

TIE 2023 32nd Edition | Supported by APTE, UNSTPB, UC

TIE M Steering Committee Members

TIE_M 2023 Second Edition | Supported by FIMM

PreliminaryProgramme for the ELECTRONIC WEEK 2023 – TIE (TIEplus), TIE M, IEEE SBC Summit and SIITME 2023 events |

Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

Standards | Books | References

Design Tools Recommendation for Participation to TIE Professional Student Design Contest

‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.