Technologies of Interconnections in Electronics
The 34th Edition,
IN PERSON in Brașov, ROMANIA
2nd-5th APRIL 2025Events:TIE-E | TIE-E+ | TIE-M | TIE-M+ | TIE-T+ | TIE-µ
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Go to TIE Concept -
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UNITBV Main Hall -
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Go to 2025 SPONSORS -
BRASOV Main Square -
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Go to TIE 2025 Classification
TIE 2025
Brașov, Romania
2nd-5th APRIL 2025
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TIE 2025 CLASSIFICATION
April 9, 2025TIE 2025 Events CLASSIFICATION
TIE-E | TIE-Eplus | TIE-Tplus | TIE-µ | TIE-M | TIE-Mplus -
TIE 2025 – BROCHURE AND ADVANCED PROGRAMME
March 28, 2025TIE 2025 – BROCHURE AND ADVANCED PROGRAMME
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Registration TIE u (micro) 2025
March 10, 2025This year’s edition of the TIEμ– Advanced Packaging Challenge will take place between April 2-5 in Brasov: https://tie.ro/
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TIE 2025 & Microelectronics Day Venue
February 26, 2025Events Location: Transilvania University of Brașov Library, Street Iuliu Maniu 41A, Brașov 500091
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TIE – T Plus Concept
January 21, 2025Thermal management optimization is an iterative process that requires multiple rounds of simulation, testing, and refinement.
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TIE – M Concept
January 21, 2025TIE M-Mechanical is a CAD Design Challenge that aims to assess students’ proficiency in computer-aided design (CAD) for mechanical components, with a focus on electronic packaging and electro-mechanical assembly.
TIE E Committees
January 21, 2025Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee -
TIE – M Plus Concept
January 21, 2025TIE-Mplus focuses on structural and TIE-Tplus on thermal management analysis of electronic packaging. The contest provides students with a comprehensive electronics development experience concerning structural integrity aspects.
TIE u (micro) Concept
January 21, 2025TIE 2024 introduced a new topic – TIE-μ, which is addressing important subjects such as advanced packaging, 2.5D/3D integration and chiplets.
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TIE-E Contest – Extended technical and scientific references
January 21, 2025Recommended Standards | Books | References
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TIE-E Concept
January 21, 2025The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.
What Design Tool to use for TIE -E Contest
January 21, 2025Design Tools Recommendation for Participation to TIE Professional Student Design Contest
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STUDENTS INNOVATION CHALLENGE
January 21, 2025It is our pleasure to announce a students competition for the upcoming 75th anniversary ECTS conference that will be held between May 27-30, 2025 at Gaylord Texan resort & Convention Center, Dallas, TX, USA.