2010 – TIE shows the way forward using CAD techiques for electronics


INTERCONNECTION TECHNIQUES in Electronics, or TIE (www.tie.ro), is a major regional event involving IEEE-CPMT Hungarian and Romanian Joint Chapter every year.

TIE tries to show young engineers the requirements of industry through computer aided design of electronic modules. All topics of CAD are covered from parts and footprint creation, to designing schematic projects and developing optimal layouts according to various industrial restrictions, ending with post-processing output files.

The Technical Committee develops up-to-date topics and assures, with the help of the Organizing Committee, that the contest takes place in a climate of fair play.

The winners of the contest receive a 10-month scholarship. The overall winner of the TIE contest is also given full membership of IEEE CPMT for a year. Along with the prizes, two winners’ trophies are handed out: the first for the winner to keep, the second being a permanent cup held each year by the winner’s university.

At the TIE 2010 workshops, there are also presentations for promoting education and training in electronic packaging. An ‘International Workshop on Electronics Technology’ lecture was delivered by Nihal Sinnadurai, IEEE Distinguished Lecturer, especially for the participating students. This focused on the relevance of reliability and quality control in the flow of manufacturing and about the importance for students to join IEEE to be familiar with standards.

Patrick Haspel of CADENCE spoke on microelectronics education. A presentation on leading CAD software and state-of-the-art technological processes was designed to encourage students to get involved in ‘Entrepreneurship in the electronics industry’.

We are eagerly anticipating next year’s TIE – its 20th edition – and welcome participants from all universities wishing to join the event in Bucharest, Romania, on 13–16 April 2011.

Andreea Bonea
Press Officer of IEEE CPMT Student Branch Chapter

(http://www.ewh.ieee.org/reg/8/news/issues/r8news_sep10.pdf – page 9)