Workshop “UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES” 26 April 2012

Workshop

„UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES”

26 April 2012

13.30–14.45 Registration
14.45-15.00 Welcome
Prof. Ioan P Mihu, “Lucian Blaga” University of Sibiu,  Prof. Paul Svasta, Politehnica University of Bucharest

 

15.00-16.30 First Session: Soldering Processes in Electronic Assembling
Chair: Prof. Zsolt Illyefalvi-Vitéz

 

 
15.00-15.30 Leadless Components Rework Processes – A bottle Neck in Electronic Assembling
Franz Leitenstern, Head of Sales, Martin GmbH – a Finetech company

 

15.30-16.00 Enhancement of the Process Capability of Solder Paste Printing  
Heinz Wohlrabe, PhD, Dresden University of Technology, Germany

 

16.00-16.30 Analysis of the temperature, the pressure and the vapour density in a VPS chamber to optimize the conditions for soldering
Attila Géczy, Ph.D, Electronic Technology Department, Budapest University of Technology

 

 
16.30-17.00 Networking Break
 
17.00-18.30 Second Session: Hetero-technologies in Electronic Packaging
Chair Prof. Dan Pitica, Technical University of Cluj Napoca

 

 
17.00-17.30 Application of Safety Bonding Methods to Gold Wire Bonding to Improve Yield and Reliability
Prof. Zsolt Illyefalvi-Vitéz, Electronic Technology Department, Budapest University of Technology

 

17.30-18.00 Organic Electronics – Materials, Devices and Technologies,
Norocel Dragos Codreanu, Ph.D., CETTI, Politehnica University of  Bucharest

 

18.00-18.30 Cost Optimizing vs. Reliability in EMS Assembling Activities
Ioan Plotog, Ph.D.,CETTI,Politehnica University of  Bucharest