Technologies of Interconnections in Electronics
The 34^th Edition,
IN PERSON in Brașov, ROMANIA
2^nd-5^th APRIL 2025
Events:TIE-E | TIE-E+ | TIE-M | TIE-M+ | TIE-T+ | TIE-^µ

Be a SPONSOR! | Pachete de sponsorizare TIE | Sponsorship packages TIE | Partners and Technical Sponsors | Platinum and Gold Sponsors

  TIE 2025 Edition Promotional Poster

Thermal management optimization is an iterative process that requires multiple rounds of simulation, testing, and refinement.

TIE M-Mechanical is a CAD Design Challenge that aims to assess students’ proficiency in computer-aided design (CAD) for mechanical components, with a focus on electronic packaging and electro-mechanical assembly.

Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

TIE-Mplus focuses on structural and TIE-Tplus on thermal management analysis of electronic packaging. The contest provides students with a comprehensive electronics development experience concerning structural integrity aspects.

TIE 2024 introduced a new topic – TIE-μ, which is addressing important subjects such as advanced packaging, 2.5D/3D integration and chiplets.

TIE-E Plus Contest Regulation 2025

Recommended Standards | Books | References

‑ PROFESSIONAL STUDENT CONTEST TIE REGULATION

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.

Design Tools Recommendation for Participation to TIE Professional Student Design Contest

TIE 2024 Events CLASSIFICATION
TIE-E | TIE-Eplus | TIE-Tplus | TIE-µ | TIE-M | TIE-Mplus

It is our pleasure to announce a students competition for the upcoming 75th anniversary ECTS conference that will be held between May 27-30, 2025 at Gaylord Texan resort & Convention Center, Dallas, TX, USA.