Technologies of Interconnections in Electronics
The 33^rd Edition,
IN PERSON in Sibiu, ROMANIA
24^th-27^th APRIL 2024
6 topics: TIE-E & TIE-E+ & TIE-M & TIE-M+ & TIE-T+ &
TIE-^µ premiere

It is our pleasure to announce a students competition for the upcoming 75th anniversary ECTS conference that will be held between May 27-30, 2025 at Gaylord Texan resort & Convention Center, Dallas, TX, USA.

Thermal management optimization is an iterative process that requires multiple rounds of simulation, testing, and refinement.

TIE 2024 Events CLASSIFICATION
TIE-E | TIE-Eplus | TIE-Tplus | TIE-µ | TIE-M | TIE-Mplus

TIE M-Mechanical is a CAD Design Challenge that aims to assess students’ proficiency in computer-aided design (CAD) for mechanical components, with a focus on electronic packaging and electro-mechanical assembly.

Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

TIE 2024 – BROCHURE AND ADVANCED PROGRAMME

Venue for TIE & TIEplus & TIE M & TIE-M plus & TIEu 2024 and Students Accomodation

TIE-Mplus focuses on structural and TIE-Tplus on thermal management analysis of electronic packaging. The contest provides students with a comprehensive electronics development experience concerning structural integrity aspects.

TIE Programme

TIE-T Plus 2024 – Promotional Poster

TIE 2024 introduces a new topic – TIE-μ, which is addressing important subjects such as advanced packaging, 2.5D/3D integration and chiplets

TIE Micro 2024 Promotional Poster

  TIE E 2024 Edition Promotional Poster

TIE-E Plus Contest Regulation 2024

Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee

TIEplus 2024 – Promotional Poster

Be a SPONSOR! | Pachete de sponsorizare TIE | Sponsorship packages TIE | Partners and Technical Sponsors | Platinum and Gold Sponsors

TIE_Mplus 2024 Second Edition & Registration LINK | Supported by FIMM

TIE_M 2024 Third Edition | Supported by FIMM

TIE-M & TIE-M Plus 2024 Steering Committee Members

Venue for TIE & TIEplus & TIE M & TIE-M plus & TIEu 2024 and Students Accomodation

TIE Events 2024 Edition Promotional Poster

Recommended Standards | Books | References

Design Tools Recommendation for Participation to TIE Professional Student Design Contest

‑ PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑ Pending updating

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.