Technologies of Interconnections in Electronics
The 33rd Edition,
IN PERSON in Sibiu, ROMANIA
24th-27th APRIL 2024 6 topics: TIE-E & TIE-E+ & TIE-M & TIE-M+ & TIE-T+ &
TIE-µ premiere
-
TIE – T Plus Concept
October 6, 2024Thermal management optimization is an iterative process that requires multiple rounds of simulation, testing, and refinement.
TIE 2024 CLASSIFICATION
April 29, 2024TIE 2024 Events CLASSIFICATION
TIE-E | TIE-Eplus | TIE-Tplus | TIE-µ | TIE-M | TIE-Mplus -
TIE – M Concept
April 22, 2024TIE M-Mechanical is a CAD Design Challenge that aims to assess students’ proficiency in computer-aided design (CAD) for mechanical components, with a focus on electronic packaging and electro-mechanical assembly.
TIE µ Committees
April 19, 2024Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee -
TIE Tplus Committees
April 19, 2024Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing CommitteeTIE E Committees
April 19, 2024Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee -
TIE 2024 – BROCHURE AND ADVANCED PROGRAMME
April 18, 2024TIE 2024 – BROCHURE AND ADVANCED PROGRAMME
TIE 2024 – Recommendations for accommodation
April 16, 2024Venue for TIE & TIEplus & TIE M & TIE-M plus & TIEu 2024 and Students Accomodation
-
TIE – M Plus Concept
April 16, 2024TIE-Mplus focuses on structural and TIE-Tplus on thermal management analysis of electronic packaging. The contest provides students with a comprehensive electronics development experience concerning structural integrity aspects.
-
TIE u (micro) Concept
March 27, 2024TIE 2024 introduces a new topic – TIE-μ, which is addressing important subjects such as advanced packaging, 2.5D/3D integration and chiplets
-
EVENT COMMITTEES TIE 2024
March 20, 2024Steering Committee Members
Technical Committee
Programme Committee
International Advisory Body
Industrial Advisor Committee
IEEE EPS Student Chapters Support Committee
Local Organizing Committee -
TIE 2024 PARTNERS – SPONSORS – TECHNICAL SPONSORS
February 23, 2024Be a SPONSOR! | Pachete de sponsorizare TIE | Sponsorship packages TIE | Partners and Technical Sponsors | Platinum and Gold Sponsors
-
TIE_M Plus 2024 PROMOTIONAL POSTER
February 23, 2024TIE_Mplus 2024 Second Edition & Registration LINK | Supported by FIMM
-
EVENT COMMITTEES TIE-M & TIE-M Plus 2024
February 23, 2024TIE-M & TIE-M Plus 2024 Steering Committee Members
TIE 2024 events Venue for Students
January 18, 2024Venue for TIE & TIEplus & TIE M & TIE-M plus & TIEu 2024 and Students Accomodation
-
TIE-E Contest – Extended technical and scientific references
January 18, 2024Recommended Standards | Books | References
-
What Design Tool to use for TIE -E Contest
January 18, 2024Design Tools Recommendation for Participation to TIE Professional Student Design Contest
TIE-E Contest Regulation
January 18, 2024‑ PROFESSIONAL STUDENT CONTEST TIE REGULATION ‑ Pending updating
-
TIE-E Concept
January 18, 2024The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students and industry representatives since 1992.