Downloadable presentations:
Oliver Krammer – Stencil Design Guidelines for Electronics Assembly Technologies
Detlef Bonfert, Karlheinz Bock – Advanced Topics In Electronic Assembling Technology
Dominik Beier – Smart electronics in home appliances – MIELE
WORKSHOP TIE 2013
„Advanced Topics in Electronic Assembling Technology”
April 25, 2013
| 13.00-14.15 | Registration |
| 14.15-14.30 | WelcomeProf. Carmen Gerigan, “Transilvania” University of Braşov,
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| 14.30-16.30 | First Session: PCB DesignSession chair: Prof. Zsolt Illyefalvi-Vitéz, Electronic Technology Department, Budapest University of Technology |
| 14.30-15.50 | PCB Design Behind EMC Thinking Lorand Foelkel, M. Eng. Würth Elektronik |
| 15.50-16.30 | Design and Measurement of Integrated Passive Devices on Flexible SubstratesDetlef Bonfert, PhD, EMFT Munich, Germany
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| 16.30-17.00 | Networking Break |
| 17.00-19.00 | Second Session: Assembling TechnologySession chair Prof. Dan Pitică, Technical University of Cluj Napoca |
| 17.00-17.30 | Selection/Supplying of Electronic Components an Important Step for Electronic Modules ManufacturingWojtek Kuczyński, Transfer Multisort Electronik, Poland |
| 17.30-18.30 | Stencil Manufacturing Technologies and Stencil Design GuidelinesOliver Krammer, Ph.D., Electronic Technology Department, Budapest University of Technology |
| 18.30-19.00 | Smart electronic devices in Household ApplianceDominik Beier – Team Leader, Development Department – Miele Electronics |
