TIE 2026 brought together Europe’s most talented students, researchers, and industry partners for four days of innovation, collaboration, and hands‑on learning. This year’s edition showcased cutting‑edge projects in electronics and embedded systems, inspiring keynotes from leading experts, and dynamic competitions that challenged participants to design, build, and demonstrate real‑world solutions.
From the debut of the TIE nano – Chip Implementation Challenge to advanced workshops, mentoring sessions, and live demonstrations, TIE 2026 strengthened the bridge between academia and industry while celebrating the next generation of semiconductor talent. With record participation and an expanded ecosystem of activities, the 2026 edition set a new benchmark for excellence, creativity, and community within the European electronics landscape.
Below, you can explore a curated selection of photos and videos that capture the energy, innovation, and atmosphere of TIE 2026.
TIE – E
📽️ Watch the video now and relive the energy of TIE – E 2026!
TIE – M
📽️ Watch the video now and relive the energy of TIE – M 2026!
TIE – n
📽️ Watch the video now and relive the energy of TIE – n 2026!
