CAD design of electronic circuits (SCM, SCH);
Creation of virtual components (parts);
SCM post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation);
CAD design of on-board interconnection structures (PCB);
Creation of PCB footprints;
Professional inter-tool communication techniques between SCM and PCB environments;
PCB post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation and manufacturing);
Standardization elements for PCB design;
Elements of analogue, digital and mixed design;
Elements of signal integrity and electromagnetic compatibility at the PCB level.

We thanks to our sponsors, companies and individuals, and we are grateful for their constant and enthusiastic technical, financial and moral support at all editions of the TIE contest for more than 20 years!

Companies

Microchip

Blue Air

Continental Automotive System SRL

Maquardt Schaltsystems SCS

Mentor Graphics

Kromberg & Schubert Romania Me

Wenglor Electronic SRL

Romstrade

Elsix

ELREF

Kuhnke Production Romania SRL

LG Advice Serv

Roel

EOC

Samway

EBS

Radio Consult

Antrice

SC Rond Electric SRL

Takata Sibiu

Cavallioti

Individuals

Radu Cosăceanu, graduate Politehnica University of Bucharest
Laszlo Dobos, graduate Politehnica University of Bucharest, former member of the teaching staff of Politehnica University, Applied Electronic Department
Vergil Goian, graduate Politehnica University of Bucharest
Mihai Jurbă, graduate University of Bucharest
Corina Sandulescu, graduate Politehnica University of Bucharest
Mihai Savu, graduate Politehnica University of Bucharest, former winner of TIE contest

Created using FlowPaper Flipbook Maker ↗

Download TIE201 Program Brochure

View Workshop Presentations

Classification
TIE 2012
~ IAC certification ~

The first 14 competitors have received from the IAC (Industrial Advisor Committee) the „PCB Designer” degree, as a recognition of their high level of knowledge in the field of CAD for development of electronic modules and assemblies.

Up to Date Issues in
Electronic Assembling Technologies
26th April 2012, Sibiu, Romania

Analysis of the temperature, the pressure and the vapour density in a VPS chamber to optimize the conditions for soldering
Géczy Attila
Budapest University of Technology and Economics
Dept. of Electronics Technology

Application of Safety Bonding Methods to
Gold Wire Bonding to Improve Yield and Reliability (and slides)
Zsolt Illyefalvi-Vitéz
Budapest University of Technology and Economics
Dept. of Electronics Technology

Organic Electronics, Materials, Devices and Technologies
Assoc. Prof. Ciprian Ionescu, Ph.D.
Assoc. Prof. Norocel Codreanu, Ph.D.
Politehnica University of Bucharest
Faculty of Electronics, Telecommunications and Information Technology

Cost Optimizing vs. Reliability in EMS Assembling Activities
Ioan Plotog, Ph.D.
Politehnica University of Bucharest
Center for Technological Electronics and Interconnection Techniques

Lead Less Rework Components Processes A Bottle Neck in Electronic Assembling
Franz Leitenstern
Head of Sales, Martin GmbH

Enhancement of Process Capability of Solder Paste Printing
H. Wohlrabe
TU Dresden Germany