Date: Thursday 5th of April 2012
Time: 10:00 a.m.
Location: B302
The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging.
Organizers for the Bucharest local stage:
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Politehnica University of Bucharest
Electronics, Telecommunications and Information Technology Faculty Center of Technological Electronics and Interconnection Techniques |
