Up to Date Issues in
Electronic Assembling Technologies
26th April 2012, Sibiu, Romania
Analysis of the temperature, the pressure and the vapour density in a VPS chamber to optimize the conditions for soldering
Géczy Attila
Budapest University of Technology and Economics
Dept. of Electronics Technology
Application of Safety Bonding Methods to
Gold Wire Bonding to Improve Yield and Reliability (and slides)
Zsolt Illyefalvi-Vitéz
Budapest University of Technology and Economics
Dept. of Electronics Technology
Organic Electronics, Materials, Devices and Technologies
Assoc. Prof. Ciprian Ionescu, Ph.D.
Assoc. Prof. Norocel Codreanu, Ph.D.
Politehnica University of Bucharest
Faculty of Electronics, Telecommunications and Information Technology
Cost Optimizing vs. Reliability in EMS Assembling Activities
Ioan Plotog, Ph.D.
Politehnica University of Bucharest
Center for Technological Electronics and Interconnection Techniques
Lead Less Rework Components Processes A Bottle Neck in Electronic Assembling
Franz Leitenstern
Head of Sales, Martin GmbH
Enhancement of Process Capability of Solder Paste Printing
H. Wohlrabe
TU Dresden Germany
