Workshop
„UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES”
26 April 2012
| 13.30–14.45 | Registration |
| 14.45-15.00 | Welcome Prof. Ioan P Mihu, “Lucian Blaga” University of Sibiu, Prof. Paul Svasta, Politehnica University of Bucharest
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| 15.00-16.30 | First Session: Soldering Processes in Electronic Assembling Chair: Prof. Zsolt Illyefalvi-Vitéz
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| 15.00-15.30 | Leadless Components Rework Processes – A bottle Neck in Electronic Assembling Franz Leitenstern, Head of Sales, Martin GmbH – a Finetech company
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| 15.30-16.00 | Enhancement of the Process Capability of Solder Paste Printing Heinz Wohlrabe, PhD, Dresden University of Technology, Germany
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| 16.00-16.30 | Analysis of the temperature, the pressure and the vapour density in a VPS chamber to optimize the conditions for soldering Attila Géczy, Ph.D, Electronic Technology Department, Budapest University of Technology
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| 16.30-17.00 | Networking Break |
| 17.00-18.30 | Second Session: Hetero-technologies in Electronic Packaging Chair Prof. Dan Pitica, Technical University of Cluj Napoca
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| 17.00-17.30 | Application of Safety Bonding Methods to Gold Wire Bonding to Improve Yield and Reliability Prof. Zsolt Illyefalvi-Vitéz, Electronic Technology Department, Budapest University of Technology
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| 17.30-18.00 | Organic Electronics – Materials, Devices and Technologies, Norocel Dragos Codreanu, Ph.D., CETTI, Politehnica University of Bucharest
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| 18.00-18.30 | Cost Optimizing vs. Reliability in EMS Assembling Activities Ioan Plotog, Ph.D.,CETTI,Politehnica University of Bucharest |
