WORKSHOP TIE 2013 – Program and presentations

Registration

Welcome

Prof. Carmen Gerigan, “Transilvania” University of Braşov,
Prof. Paul Svasta, Politehnica University of Bucharest

First Session: PCB Design

Session chair: Prof. Zsolt Illyefalvi-Vitéz, Electronic Technology Department, Budapest University of Technology

PCB Design Behind EMC Thinking

Lorand Foelkel, M. Eng. Würth Elektronik

Design and Measurement of Integrated Passive Devices on Flexible Substrates

Detlef Bonfert, PhD, EMFT Munich, Germany

Networking Break

Second Session: Assembling Technology

Session chair Prof. Dan Pitică, Technical University of Cluj Napoca

Selection/Supplying of Electronic Components an Important Step for Electronic Modules Manufacturing

Wojtek Kuczyński, Transfer Multisort Electronik, Poland

Stencil Manufacturing Technologies and Stencil Design Guidelines

Oliver Krammer, Ph.D., Electronic Technology Department, Budapest University of Technology

Smart electronic devices in Household Appliance

Dominik Beier – Team Leader, Development Department – Miele Electronics