WORKSHOP TIE 2013

„Advanced Topics in Electronic Assembling Technology”

13.00-14.15	Registration
14.15-14.30	Welcome Prof. Carmen Gerigan, “Transilvania” University of Braşov, Prof. Paul Svasta, Politehnica University of Bucharest
*14.30-16.30*	First Session: PCB Design Session chair: Prof. Zsolt Illyefalvi-Vitéz, Electronic Technology Department, Budapest University of Technology
14.30-15.50	PCB Design Behind EMC Thinking Lorand Foelkel, M. Eng. Würth Elektronik
15.50-16.30	Design and Measurement of Integrated Passive Devices on Flexible Substrates Detlef Bonfert, PhD, EMFT Munich, Germany
16.30-17.00	Networking Break
*17.00-19.00*	Second Session: Assembling Technology Session chair Prof. Dan Pitică, Technical University of Cluj Napoca
17.00-17.30	Selection/Supplying of Electronic Components an Important Step for Electronic Modules Manufacturing Wojtek Kuczyński, Transfer Multisort Electronik, Poland
17.30-18.30	Stencil Manufacturing Technologies and Stencil Design Guidelines Oliver Krammer, Ph.D., Electronic Technology Department, Budapest University of Technology
18.30-19.00	Smart electronic devices in Household Appliance Dominik Beier – Team Leader, Development Department – Miele Electronics