2022

ELECTRONIC WEEK 2022 – The Autumn Convention of Electronic Packaging (TIE 2022 + SIITME 2022)

TIE 2022 is a traditional, in person event that is hosted by the University Politehnica of Bucharest and will take place at the Central Library of UPB from 24th to 29th October 2022 as part of the Electronic Week of Electronics Packaging Community 2022

More details about the venue will be provided early September 2022.

TIEm is a mechanical design challenge in the context of electronics. 

The 2022 Edition will be the kick-off point for a new design challenge called TIEm with support from the Faculty of Mechanical Engineering and Mechatronics of UPB.

More details will be published early October 2022.

TIEplus is postponed until Spring 2023. 


 

Venue for THE ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2022

Dear Participants,

Please take into consideration the following information about the TIE 2022 and SIITME 2022 conference location and venue:

CITY: Bucharest, Romania

Events Location: Central Library in Politehnica University of Bucharest Campus

Hotel: Ibis Bucharest Politehnica Hotel

Venue of the Electronic Week

The ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2022 will take place at the Central Library of the Politehnica University, which is an 8-minute walk from the Ibis hotel.

Currency

*** The national currency is RON/LEI, 1 euro= approx. 4,83 RON

➢ Preferably to take RON/lei from the ATMs at the airport, usually the exchange office has a lower exchange rate. (1 euro = approx. 4,83 lei)

Traveling to Bucharest

Airports:

There is only one airport near Bucharest, Henri Coanda Otopeni International Airport (OTP)

Henri Coanda International airport – Hotel Ibis Politehnica, view map for detailed directions, https://g.page/ibisBucharestPolitehnica?share

  1. Take the bus (783) towards Piata Unirii, 12 stops until Piata Victoriei Station
  • Take the tram (1) towards Pantelimon/Republica 5 stops until Grozavesti Station

Estimate time: 1h 10 min outside of rush hours (6:00 – 8:00 and 11:00 – 12:00), 2h if you arrive in the morning rush hours (8:00 – 10:00)

  1. Taxi- tariff 1,89 lei/ km, approx. 40 lei (approx. no more 9 euro)- IT’S BEST TO HAVE ROMANIAN CURRENCY FOR TAXI
  2. We recommend Uber (https://www.uber.com ) or Bolt (https://bolt.eu/ro/), they’re similar with regular taxi and they’re reliable in Bucharest. You can also pay from your card directly; no cash is necessary.

 

 

Venue of the Electronic Week

The ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2022 will take place at the Central Library of the Politehnica University, which is an 8-minute walk from the Ibis hotel.

 

We are looking forward in meeting you in Bucharest at Electronic Week 2022!

www.romania.careers-continental.com

www.facebook.com/RomaniaContinental

Miele Tehnica Brașov is a subsidiary of Miele & Cie. KG, Germany. It was established in 2009 as a second electronics factory in the group, after the plant in Gütersloh.

The Miele plant in Braşov currently has 300 employees and produces electronic components for a wide range of Miele appliances, such as washing machines, tumble dryers, vacuum cleaners, ovens and others. The products Miele offers to its customers set the standards for durability, performance, ease of use, energy efficiency, design and service products.

In august 2015, in Brașov, a software development division was created. Within this new division the software for a wide variety of Miele appliances is developed.

The facility in Brașov is equipped with state-of-the-art technology and all quality requirements are respected according to the Miele Group’s standards. This fact is acknowledged by all the certifications currently in place: ISO 9001, ISO 14001, ISO 50001, OHSAS 18001 and SA 8000.

Address: No.1 Carl Miele Street, 507065 Feldioara, Braşov, Romania

Phone: 0040-372-217800, Fax: 0040-372-217810

Email:  office@ro.miele.com, recrutare@ro.miele.com

www.bosch.ro

www.facebook.com/BoschRomania

Be a SPONSOR! 

Sponsorship packages Electronic Week 2021 (TIE and SIITME events)

 

Partners

 

Technical Sponsors

 

Platinum Sponsors


 

Gold Sponsors

 

Sponsors

 

Steering Committee

General Chair:

Paul SVASTA, Politehnica University of Bucharest, APTE

General Academic Co-Chair:

Dan PITICĂ, Technical University of Cluj-Napoca

General Industrial Co-Chair:

Cosmin MOISĂ, Continental Automotive, Timişoara

 
TIE 2021 Chair:

Liviu VIMAN, Technical University of Cluj-Napoca

TIE 2021 Co-Chair:

Gabriel CHINDRIŞ, Technical University of Cluj-Napoca


Steering Committee
Members:

Dorel AIORDĂCHIOAIE, Dunărea de Jos University of Galaţi
Ilie BERILIU, Lucian Blaga University of Sibiu
Alexandru BORCEA, Romanian Association for Electronic and Software Industry
Radu BOZOMITU, Gh. Asachi Technical University of Iaşi
Vlad CEHAN, Gh. Asachi Technical University of Iaşi
Gabriel CHINDRIŞ, Technical University of Cluj-Napoca
Eugen COCA, Ştefan cel Mare University of Suceava
Elena DOICARU, University of Craiova
Aurelia FLOREA, Human Resources Manager, Miele Brasov
Aurel GONTEAN, Politehnica University of Timişoara
Tecla GORAŞ, Gh. Asachi Technical University of Iaşi
Mihaela HNATIUC, Maritime University of Constanţa
Ciprian IONESCU, University Politehnica of Bucharest
Ioan LIŢĂ, University of Piteşti
Bogdan MIHĂILESCU, University Politehnica of Bucharest, APTE
Viorel NICOLAU, Dunărea de Jos University of Galaţi
Cristina OPREA, Tensor srl
Gheorghe PANĂ, Transilvania University of Braşov
Daniela TĂRNICERIU, Gh. Asachi Technical University of Iaşi
Daniel TRIP, University of Oradea
Adrian TULBURE, 1 Decembrie 1918 University of Alba Iulia
Gabriel VLĂDUŢ, Romanian Association for Technological Transfer and Innovation


International Advisory Body:

Karlheinz BOCK, TU Dresden, Electronics Packaging Lab IAVT, Dresden, Germany
Detlef BONFERT, Fraunhofer EMFT, Munich Germany
Joseph FJELSTAD, CEO of Verdant Electronics, USA
Zsolt ILLYEFALVI-VITEZ, University of Technology and Economics, Budapest, Hungary
Pavel MACH, Czech Technical University in Prague, Czech Republic
Alain MICHEL, ANSYS France
Jim MORRIS, Portland State University, Oregon USA
Andy SHAUGHNESSY, Managing Editor of The PCB Design Magazine and PCBDesign007, USA
Nihal SINNADURAI, IMAPS ELC Past President, U.K.
Heinz WOHLRABE, TU Dresden, Germany
Klaus-Jürgen WOLTER, TU Dresden, Germany


Technical Committee – Academic Trainers

Chairman:

Norocel CODREANU, Politehnica University of Bucharest

Co-Chairman:

Liviu VIMAN, Technical University of Cluj-Napoca


Members:

Mihaela ANDREI, Dunărea de Jos University of Galaţi
Constantin BARABAŞA, Gh. Asachi Technical University of Iaşi
Marius CARP, Transilvania University of Braşov
Emilian CEUCA, 1 Decembrie 1918 University of Alba Iulia
Cătălin CONSTANTINESCU, University of Craiova
Silviu EPURE, Dunărea de Jos University of Galaţi
Tecla GORAŞ, Gh. Asachi Technical University of Iaşi
Septimiu LICĂ, Politehnica University of Timişoara
Claudiu LUNG, University of Baia Mare
Mihai DĂRĂBAN, Technical University of Cluj-Napoca
Adrian TĂUT, Technical University of Cluj-Napoca
Raul FIZEȘAN, Technical University of Cluj-Napoca
Alin Gheorghiță MAZĂRE, University of Piteşti
Maximilian NICOLAE, University Politehnica of Bucharest
Mihaela PANTAZICĂ, University Politehnica of Bucharest
Mirel PĂUN, Maritime University of Constanţa
Adrian PETRARIU, Ştefan cel Mare University of Suceava
Adrian ŞCHIOP, University of Oradea
Emanoil TOMA, Lucian Blaga University of Sibiu


Industrial Committee

Chairman:

Mihai FEDOREAC, Continental Automotive, Timişoara


Industrial Co- Chair:

Bogdan POPESCU, MICROCHIP Technology, Bucureşti

Members:

Alexandru AMARIEI, Continental Engineering Services, Timişoara
Gheorghe AMARIEI, Continental Engineering Services, Timişoara
Adrian BOSTAN, MICROCHIP Technology, Bucureşti
Aurelian BOTĂU, Continental Automotive, Timişoara
Valentin Cătălin BURCIU, Draexlmaier Romania
Mihai BURGHEAUA, Continental Automotive, Iaşi
Iulian BUŞU, LUMPED Elements, Bucureşti
Mihai CENUȘĂ, Continental Automotive, Iaşi
Alin GHENESCU, Continental Automotive Systems, Sibiu
Nicolae GROSS, Continental Automotive Systems, Sibiu
Florin HEREDEU, Plexus, Oradea
Florin Bogdan MARANCIUC, Continental Automotive Systems, Sibiu
Ionuţ Alexandru MARIN, Continental Automotive Systems, Sibiu
Andrei NICORAŞ, Plexus, Oradea
Cosmin OBREJA, Vitesco Technologies Engineering Romania
Andras PARANICI, Vitesco Technologies Engineering Romania
Bogdan PICĂ, NTT DATA Romania, Cluj
Mariana POPÂRLAN, Vitesco Technologies Engineering, Sibiu
Alexandru Gheorghiță RĂCHERU, Continental Automotive, Sibiu
Csaba TĂRCEAN, Continental Engineering Services, Timişoara
Bogdan Iulian TELEGARIU, Vitesco Technologies Engineering, Sibiu
Corneliu TOMA, Digitech SRL, Bucureşti
Mihai VIDRAŞCU, Autonomous Flight Technology, Bucureşti
Radu VOINA, KEYTEK Innovation, Alba Iulia

IEEE EPS Student Chapters Support Committee

Chair: Alin GRAMA, IEEE-EPS, Technical University of Cluj-Napoca, SBC Chair

Co-Chair: Mădălin MOISE, IEEE-EPS, University Politehnica of Bucharest

Members:

Andreea DUMITRAȘCU, University Politehnica of Bucharest
Valentina DUMITRAȘCU, University Politehnica of Bucharest
Alina MARCU, University Politehnica of Bucharest
Daniela PAVEL, University Politehnica of Bucharest
Elena STETCO, Technical University of Cluj-Napoca


Technical secretariat

Chair: Delia LEPĂDATU, University Politehnica of Bucharest

Co-Chair:  Ana Maria CHIRILĂ, Continental Automotive, Timișoara

Members:

Cristina LEPĂDATU, Association for Promoting Electronic Technology Bucharest
Bogdan MIHĂILESCU, Association for Promoting Electronic Technology Bucharest
Maria PĂTULEANU, University Politehnica of Bucharest
Florentina STĂLINESCU, Association for Promoting Electronic Technology Bucharest
Adelina ILIES, Technical University of Cluj-Napoca, Romania


TIE
Plus Steering Committee

Chairman:

Cătălin NEGREA, Continental Automotive, Timişoara

Co-Chairman:

Marcel MANOFU, Continental Automotive, Timişoara, Romania

Members:

Norocel CODREANU, University Politehnica of Bucharest
Cosmin MOISĂ, Continental Automotive, Timişoara
Dan PITICĂ, Technical University of Cluj-Napoca
Paul SVASTA, University Politehnica of Bucharest

TIEPlus Organizing Committee

Coordinator: Marcel MANOFU, Continental Automotive, Timişoara

Norocel CODREANU, University Politehnica of Bucharest
Mihai DĂRĂBAN, Technical University of Cluj-Napoca, Romania
Bogdan MIHĂILESCU, Association for Promoting Electronic Technology
Andreea-Luminiţa TASNADI, Continental Automotive, Timişoara
Radu VOINA, Principal Engineer, Keytek, Alba Iulia, Romania

 

TIEPlus Technical Committee Members

Mihai BURGHEAUA, Layout Engineer, Continental-OSRAM, Iaşi
Norocel CODREANU, University Politehnica of Bucharest
Danilo Di FEBO, Business Development, CST, Italy
Markus LAUDIEN, Lead Application Engineer, ANSYS, Germany
Marcel MANOFU, SI/PI Principal Eng., Continental Automotive, Timişoara
Răzvan NEAG, SI/PI Eng., Continental Engineering Services, Timişoara
Cătălin NEGREA, Continental Automotive, Timişoara
Camelia STOICA, EBU Technical Services, INAS, Craiova
Roxana VLĂDUȚĂ, SI Engineer, eSilicon, București
Radu VOINA, Digilent, Cluj-Napoca

TIEPlus 2021 Registered Participants: TBD

 

 TIEPlus University Licensing Sponsors:

 

Extended technical and scientific resources for TIE 2019 international design contest

Download PDF

Standards

IPC CHECKLIST for Producing Rigid PCBAs;
IPC-2221 – Generic Standard on Printed Board Design;
IPC-2222 – Sectional Design Standard for Rigid Organic Printed Boards;
IPC-2223 – Sectional Design Standard for Flexible Printed Boards;
IPC-7351 – Generic Requirements for Surface Mount Design and Land Pattern Standard;
IPC-2141 – Controlled Impedance Circuit Boards and High Speed Logic Design;
IPC-2581 – Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology;
IPC-4101 – Specification for Base Materials for Rigid and Multilayer Printed Boards;
IPC-6012 – Qualification and Performance Specification for Rigid PCBs;
IPC-7525 – Stencil Design Guidelines;
IPC-7527 – Requirements for Solder Paste Printing;
IPC-A-600 – Acceptability of Printed Boards.

Books

» Coombs C. F., Jr., “Printed circuits handbook” – 6th edition, McGraw Hill Professional, 1000 pp., 2007, ISBN 978-0071510790;
» Harper C. A., „Electronic packaging and interconnection handbook”, McGraw-Hill, 2000;
» Lau J., Wong C. P., Prince J. L., Nakayama W., „Electronic Packaging – Design, Materials, Process and Reliability”, McGraw-Hill, 1998;
» Johnson H., Graham M., „High-speed digital design, a handbook of black magic”, Prentice Hall PTR, New Jersey, 1993;
» Brooks D., „Signal Integrity Issues and Printed Circuit Board Design”, Prentice Hall PTR, 432 pp. 2003;
» Bogatin E., „Signal and Power Integrity – Simplified”, Prentice Hall, Boston, 2010.
» Jamnia A., „Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis”, 2nd edition, CRC Press, 2008;
» Harper C. A., „High Performance Printed Circuit Boards”, McGraw-Hill professional engineering, Professional Engineering, McGraw-Hill, 2000;
» Ulrich R. K., Brown W. D., „Advanced electronic packaging”, 2nd edition, IEEE Press – Wiley, 812 pp., 2006;
» Xingcun C. T., „Advanced Materials for Thermal Management of Electronic Packaging”, Springer Science & Business Media, 2011;
» Jin Y., Wang Z., Chen J., “Introduction to Microsystem Packaging Technology”, CRC Press, Boca Raton, 218 pp., 2011;
» Rohsenow W. M., Hartnett J. P., Cho Y. I., “Handbook of heat transfer”, McGraw-Hill, 1998;
» Ganesan S., Pecht M., “Lead-free Electronics”, John Wiley & Sons, New Jersey, 766 pp., 2006;
» Tummala R., Rymaszewski E. J., Klopfenstein A. G., „Microelectronics Packaging Handbook: Technology Drivers”, Part 1, Springer Science & Business Media, 2012.


Download the presentation “What Design Tool to use for TIE Contest” [PDF]

Download TIE Contest Regulation [PDF]

INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE)

‑ INTERNATIONAL PROFESSIONAL STUDENT CONTEST ‑

I. PURPOSE AND OBJECTIVES

TIE scientific and technical student event has the main purpose of evaluating and certifying the level of students knowledge and skills in the field of technological computer aided design (CAE-CAD-CAM) of printed circuit boards (PCB) and electronic modules, with focus to both THT (through hole technology) and SMT (surface mount technology) technologies.

The contest is based on the knowledge obtained during the electronics courses for design and manufacturing of analogue, digital and mixed electronic modules, as well as on the advanced knowledge of developing PCB interconnection structures according to IPC (Association Connecting Electronics Industries) and other international standards recognized by the electronics industry worldwide. TIE event is intended to be a guild certification, a brand in the field of PCB design.

 

Aim of the contest:

  • – Arousing the students’ interest in the electronic packaging issues and PCB interconnection structures;
  • – Evaluating of knowledge in a competitive environment;
  • – Certifying by industry, with the support of the IAC (Industrial Adviser Committee), of competitors’ CAD skills;
  • – Supporting the electronics industry with professional human resources.

Objectives:

  • – Familiarizing the students with the necessary activities for designing the electronic projects of the analogue, digital and mixed modules and the PCB interconnection structures, in order to meet the demands required by the project/product specifications;
  • – Reaching a high level of professionalism in using CAD software systems in this field;
  • – Rising the awareness of the electronics industry on the existing human resources and realizing a strong partnership between academia and industry;
  • – Increasing of job demands for the career of electronics engineer from today students and of job offers from the industrial environment.

II. ORGANIZATION

The international student contest “Interconnection Techniques in Electronics (TIE)” is coordinated by “Politehnica” University of Bucharest, Center for Technological Electronics and Interconnection Techniques (UPB-CETTI) and continuously supported by IEEE CPMT HU&RO Joint Chapter. The event is yearly organised, in an itinerant way, by a university  member of the EPETRUN consortium and network (Electronic Packaging Education Training and Research University Network), being also opened to all European universities interested in education and training in the field  of electronic packaging.

 

     The contest is supervised by six committees:

a. Steering Committee (SC);

b. Technical Committee (TC);

c. Local Committee (LC);

d. Industrial Adviser Committee (IAC);

e. Public Relations Committee (PRC);

f. International Consultant Committee (ICC).

In the above mentioned committees take part representatives of EPETRUN, European universities, specialists from industry and members of non-guvernamental organizations involved in electronics. These committees take care of all technical and organisational aspects of the contest and of the whole TIE event.

 

The contest has two stages:  

  1. 1. local stage (which takes place in each university centre interested to participate to TIE);
  2. 2. final stage (which takes place in an university centre selected by the steering committee at least one year before the contest).

 

The subjects and the evaluation form will be proposed by the IAC (Industrial Adviser Committee) and will be completed/finalized by the TC (Technical Committee).

On the day before the contest day TC will finish and optimize the subjects and the evaluation form.

On the contest day TC + IAC will define the “evaluation teams” involved in evaluation of students (each composed of minimum two officials/experts) and the “supervisory team” (which validate the final score of the student, if necessary).

The supervisory team is activated and requested for an additional evaluation only in case of ambiguity during the evaluation process, in order to decide the final score. If not necessary, the final score is set by the evaluation team.

The students will be informed regarding this important issue in the new released TIE regulation and during the technical meeting which takes place on the day before the contest day.

The evaluation form will contain three signatures, the two of the evaluation officials/experts and one of the evaluated student; if necessary, additional signatures of the supervisory team will be placed on the form.

The student will leave the contest seat/place only after the evaluation form is totally finished and closed (by the signatures specified above).

 

III. TOPICS *

  1. 1. CAD design of electronic circuits (SCM, SCH);
  2. 2. Creation of virtual components (parts);
  3. 3. SCM post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation);
  4. 4. CAD design of on-board interconnection structures (PCB);
  5. 5. Creation of PCB footprints;
  6. 6. Professional inter-tool communication techniques between SCM and PCB environments;
  7. 7. PCB post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation and manufacturing);
  8. 8. Standardization elements for PCB design;
  9. 9. Elements of analogue, digital and mixed design;
  10. 10. Elements of signal integrity, power integrity and electromagnetic compatibility at the PCB level.

* see on www.tie.ro all the technical topics/issues requested by TC.

IV. CONTEST RULES

 

  1. 1. Each university will participate at the final stage with 4 students, 3 accepted competitors (3 bachelor students + 0 master students or 2 bachelor students + 1 master student) and 1 reserve (student placed in the local stage ranking after the first three), possible to participate only if one of the first three students is not able to take part at the final stage due to a force majeure (an extraordinary event or circumstance beyond the control of the participating student);
  2. 2. The participation fee for a university taking part at the final stage is 200 Euro.
  3. 3. Any student can apply at the local stage of the contest if he/she proves he/she follows the courses of an accredited university;
  4. 4. The organization of the local stage is under the attributions of the universities involved in EPETRUN and other European universities;
  5. 5. The lists of qualified students for the final stage (3 + 1 reserve) will be sent by the participating university to the LC of the organising university at least two weeks before the final stage, according to the official demands;
  6. 6. The contest time for the local stage is depending on local rules of the organising university. For the final stage the contest time is 240 minutes;
  7. 7. It will be mandatory for each student/competitor to participate with all the necessary hardware & software resources, in order to take part at the contest; the student/university has to prove the existence of the license for the CAD system used in the contest. The organizers will not provide any licensed software to the competitors, their main task being to manage the TIE contest and the whole scientific event around it;
  8. 8. During the contest, the student can use her/his own documentation, paper-based or in electronic format. The draft papers will be provided by LC/TC officials;
  9. 9. During the final stage of the contest the access to Internet is forbidden, all the technical documentation being available for competitors on a CD/pen-drive;
  10. 10. The contest regulations can be presented to participants at the beginning of the contest, if required;
  11. 11. During the contest, the students are not allowed to discuss to each other, to ask explanations from another competitor regarding contest issues, to borrow personal objects or documents. During the contest, the explanations can be asked only from TC officials;
  12. 12. The contest will have an official fixed “pre-time” of 30 minutes, in which the competitors will study deeply the subjects and will ask questions; after handing-in the subjects, the students will use these 30 minutes to study the contest subjects without making any design activity on the computer and/or writing down notes and calculus;
  13. 13. The contest will have an official fixed “post-time” of 15 minutes, in which the competitors will save, archive, copy to an official TC CD/pen-drive, close applications, etc.;
  14. 14. In case of any technical problem, the student has to announce as soon as possible the situation to LC/TC officials who are supervisors in the contest room;
  15. 15. The students could benefit by the extension of the contest design time in certain conditions: hardware/software problems, breakdown of the workstation and related issues. Any other situations will not be accepted for the extension of the official contest time;
  16. 16. The evaluation at the local stage is done by one or two officials, together with the student who solved the subject. If the student is not present when the evaluation activity starts, he/she will be called when the evaluation session of his/her group ends. If he/she is still not present, his/her subject will be evaluated in his/her absence;
  17.  17. The evaluation at the final stage (see also the “V) ORGANIZATION” paragraph) is mandatory done by officials from TC and IAC, together with the student who has solved the subject. If the student is not present when the evaluation activity starts, he/she will be called later or at the end of the evaluation session. If he/she is still not present, the subject will be evaluated in his/her absence, but in the presence of a witness student from the same university;
  18. 18. The evaluation of the subjects at the final stage is public;
  19. 19. The students who participate at the final stage will be awarded with diplomas and prizes: three prizes and five mentions;
  20. 20. Additionally, IAC will attest the best ranked students with “PCB Designer” certificates recognized by the electronics industry;
  21. 21. The first prize winner is not allowed to participate at the future editions of the TIE contest;
  22. 22. The students who are not present at the contest and who are on the contest list will be referred to as “not present”, and those who leave before the contest time expires will be referred to as “abandon”;
  23. 23. The contest regulation can be found on the web-page of the contest (www.tie.ro), in English, on the web-pages of the EPETRUN university network and other participating universities, depending on the specific of their web-pages;
  24. 24. Any change in this document will be announced to all universities participating at the TIE contest immediately after the new version will be released.

Rev: November 9, 2017