2023

Model of Certificate of Competence in PCB design

 

Industrial Advisor Committee of TIE 2023 would like to congratulate all participants.

 

Position Contestant
P I Vasilache Cristian        
P II Panait Mihai Vlăduț  
P III Barbu Albert – Patric
M I Cristea Teodor Andrei        
M II Oprea Cristian Nicolae        
M III Beșliu-Gheorghe Andrei Alexandru        
M IV Berciu Mihaela Georgiana        
M V Veliciu Vlad        
Boroica Vasile
Frățian Tiberiu Alexandru
Frimu Cosmin Ionuț
Bobeanu Elena Alexandra
Cucireavîi Ana-Maria
Neagu Alexandra-Cristina
Ursuțiu Toma Liviu
Pătrașcu Andrei
Oncioiu Denis Cosmin
Petraru Denisa Ionela
Jâjâie Anda
Chioreanu Andreea
Sanda Eugen-Ionuț
Slavic Marian
Gabor Paul Mihai
Șoacă Geani-Dumitru
Murariu Mircea Andrei
Mirovici Ciprian
Taranu Teodor
Attila Jakab Jozsef

 

Venue for TIE & TIE M 2023 and Students Accomodation

 

Dear TIE & TIE M Students,

Please take into consideration the following information about the TIE 2023 location and venue:

CITY: Craiova, Romania

Events Locations:

Casa Universitarilor, Calea Unirii no. 57

   

Venue of the TIE 2023

The ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2023 will take place at the Casa Universitarilor.

The address of the student dormitory:

Căminul Studențesc nr. 14, Calea București 107, Craiova 200478

Google maps link with the location of the student dormitory:

https://maps.app.goo.gl/8xUqyqGoRHcs1vmU8

The contact person for accommodation in the student dormitory is:
  – Name: Dragoș Andrei CÎRCIUMARIU
– E-mail:dragos.circiumariu@edu.ucv.ro

We are looking forward in meeting you in Craiova at TIE 2023!

updated 09th of October 2023

Electronic Week 2023 – Brochure and Advanced Programme [Download PDF]

TIE 2023 Promotional Poster

TIE_M Steering Committee

Chair:

Daniel COMEAGĂ, National University of Science and Technology POLITEHNICA of Bucharest

Co-Chair:

Philip COANDĂ, Continental Automotive Romania

Members:

Leon BRAI, Robert BOSCH SRL

Bogdan GRĂMESCU, National University of Science and Technology POLITEHNICA of Bucharest

Bogdan MIHĂILESCU, National University of Science and Technology POLITEHNICA of Bucharest

Cosmin MOISĂ, Continental Automotive, Timişoara

Gabriel RACZ, Lucian Blaga University of Sibiu

Carmen STICLARU, University Politehnica of Timişoara

Paul SVASTA, National University of Science and Technology POLITEHNICA of Bucharest

 

TIE_M Organizing Committee

Coordinator:

Alina SPÂNU, National University of Science and Technology POLITEHNICA of Bucharest

Members:

Victor CONSTANTIN, National University of Science and Technology POLITEHNICA of Bucharest

Mădălin MOISE, National University of Science and Technology POLITEHNICA of Bucharest

Edgar MORARU, National University of Science and Technology POLITEHNICA of Bucharest

Delia PRISECARU, National University of Science and Technology POLITEHNICA of Bucharest

 

TIE_M Technical Committee

Members:

Philip COANDĂ, Continental Automotive Romania

Emil NIȚĂ, National University of Science and Technology POLITEHNICA of Bucharest

Răzvan PACURAR, Technical University of Cluj Napoca

Radu PETRUȘE, Lucian Blaga University of Sibiu

Carmen STICLARU, University Politehnica of Timişoara

 

TIE_M Industrial Committee

Falk ALEXANDRU, Continental Automotive Romania

Philip COANDĂ, Continental Automotive Romania

Cătălin DIACONU, GMV

Ion DOGARIU, Continental Engineering Services, Romania

Cristina LATEȘ, Continental Automotive Romania

Constantin POPESCU, Continental Automotive Romania

Iulia-Eliza TINCA, Continental Automotive Romania

 

 TIE-M University Licensing Sponsors

TIE_M 2023 Second Edition Promotional Poster

Tuesday, October 17
2nd SUMMIT OF IEEE EPS & NTC STUDENT BRANCH CHAPTERS
(Casa Universitarilor –  Nicolae Romanescu Room, 1st floor)
08:30 – 09:00 Registration
09:00 – 09:30 Opening ceremony
09:30 – 10:30 Oral session
10:30 – 10:45 Coffee break
10:45 – 12:45 Chiplets technology – Panel discussion
12:45 – 13:30 Lunch
13:30 – 14:30 SBCs activity report, common future cooperation
14:30 – 15:00 Transfer to Hella
15:00 – 15:30 HELLA presentation                                                                   
15:30 – 17:30 HELLA visit
17:30 – 18:00 Closing ceremony
18:00 – 18:30 Transfer  to Casa Universitarilor
18:30 Networking Dinner

 

Wednesday, October 18 (Educational)
08:30  Registration for PDC (Casa Universitarilor)
09:00 – 10:45 PDC A
(Casa Universitarilor – Nicolae Iorga Room, 1st floor)
 PDC B
(Casa Universitarilor – Mihai Eminescu Room, 1st floor)
10:45 – 11.15 Coffee break
11:15 – 12:30 PDC A
(Casa Universitarilor – Nicolae Iorga Room, 1st floor)		 PDC B
(Casa Universitarilor – Mihai Eminescu Room, 1stfloor)
12:45  Registration for Education Workshop (Casa Universitarilor)
13:00 – 15:30 Strategic Partnership for Education Workshop
(Casa Universitarilor – Nicolae Romanescu Room, 1st floor)
 
15:00 – 18:00  Registration SIITME 2023 (University of Craiova – Ground floor)
16:00 – 16:30 SIITME 2023 Opening ceremony
(University of Craiova – Aula MIHAI I)
16:30 – 18:15 Plenary Oral Session 1
18:15 – 18:30 Coffee break
18:30 – 19:30 Industrial Session 1
20:00 – 21.30 Welcome to SIITME dinner
(Casa Universitarilor)
21:30 – IEEE – Hu&Ro EPS&NTC Joint Chapter Meeting – members & guests
 

Thursday, October 19 (SIITME)
(University of Craiova – Aula MIHAI I)
08:30 – 12:30 Registration
09:00 – 11:00 Plenary Oral Session 2
11:00 – 11:20 Coffee Break
11:20 – 12:20 Industrial Session 2
12:20 – 13:10 Conference Lunch
13:10 – 15:10 Poster Session 1
15:10 – 15:30 Coffee Break
15:30 – 17:30 Plenary Oral Session 3
17:30 – 19:30 City tour
19:30 – Conference dinner
(Casa Ghincea Restaurant, Str. Madona Dudu, no. 31, Craiova)

 

Friday, October 20 (SIITME) – paralel sessions
(University of Craiova –  Aula MIHAI I)
09:00 – 11:00 Poster Session 2
11:00 – 11:30 Coffee Break
11:30 – 13:30 Plenary Oral Session 4
13:30 – 14:30 Conference Lunch
14:30– 16:30 Poster Session 3
16:30 – 17:30 Industrial Session 3
17:30 – 18:00 Coffee Break
18:00 – 19:00 Networking Session
18:00 – 19:00 Steering Committee Meeting 
19:00 – 20:00 Awarding ceremony; Welcome to SIITME 2024
20:30 – 22:00 Dinner
(Casa Universitarilor)
 

Friday, October 20 (TIE_M) – paralel sessions
(Casa Universitarilor –  Mihai Eminescu Room, 1st floor)
07:30 – 08:00 TIE_M 2023 contest preliminary activities
08:00 – 12:30 TIE_M 2023 CONTEST
12:30 – 13:30 Lunch Break
13:30 – 17:45 TIE_M Assessment of the projects; litigations
17:45 – 18:45 TIE_M 2023 subject demystification (relevant for TIE participants)
17:45 – 18:45 Steering Committee Meeting
19:00 – 20:00 Awarding ceremony for TIE_M contest
(University of Craiova – Aula MIHAI I)
20:30 – 22:00 Dinner
(Casa Universitarilor)
 

Friday, October 20 (TIE) – paralel sessions
(Casa Universitarilor – Nicolae Romanescu Room, 1st floor)
07:30 – 08:00 TIE 2023 contest preliminary activities
08:00 – 12:30 TIE 2023 CONTEST
12:30 – 13:30 Lunch Break
13:30 – 17:45 Assessment of the projects; litigations
17:45 – 18:45 TIE Plus 2024 There are things to discover
17:45 – 18:45 Steering Committee Meeting
19:00 – 20:00 Awarding ceremony for TIE 2023 contest
(University of Craiova – Aula MIHAI I)
20:30 – 22:00 Dinner
(Casa Universitarilor)
 

Saturday, October 21 (TIE)
09:00 – 11:00 Event retrospective 

 

EEST | GMT +3h

Electronic Week 2023 – TIE (TIE_M) & SIITME – Final Program [PDF]

Steering Committee

General Chair:

Paul SVASTA, Politehnica University of Bucharest, APTE

General Academic Co-Chair:

Dan PITICĂ, Technical University of Cluj-Napoca

General Industrial Co-Chair:

Cosmin MOISĂ, Continental Automotive, Timişoara


TIE 2023 Chair:

Sanda-Diana FIRINCĂ, University of Craiova

TIE 2023 Co-Chair:

Mircea-Cătălin CONSTANTINESCU, University of Craiova


Steering Committee Members:

Dorel AIORDĂCHIOAIE, Dunărea de Jos University of Galaţi
Alexandru BORCEA, Romanian Association for Electronic and Software Industry
Radu BOZOMITU, Gh. Asachi Technical University of Iaşi
Vlad CEHAN, Gh. Asachi Technical University of Iaşi
Gabriel CHINDRIŞ, Technical University of Cluj-Napoca
Eugen COCA, Ştefan cel Mare University of Suceava
Norocel CODREANU, National University of Science and Technology POLITEHNICA of Bucharest
Elena DOICARU, University of Craiova
Aurelia FLOREA, Human Resources Manager, Miele Brașov
Aurel GONTEAN, Politehnica University of Timişoara
Tecla GORAŞ, Gh. Asachi Technical University of Iaşi
Mihaela HNATIUC, Maritime University of Constanţa
Ciprian IONESCU, National University of Science and Technology POLITEHNICA of Bucharest
Ioan LIŢĂ, National University of Science and Technology POLITEHNICA of Bucharest, University Center of Piteşti
Bogdan MIHĂILESCU, National University of Science and Technology POLITEHNICA of Bucharest, APTE
Viorel NICOLAU, Dunărea de Jos University of Galaţi
Cristina OPREA, Tensor srl
Gheorghe PANĂ, Transilvania University of Braşov
Daniela TĂRNICERIU, Gh. Asachi Technical University of Iaşi
Daniel TRIP, University of Oradea
Adrian TULBURE, 1 Decembrie 1918 University of Alba Iulia
Liviu VIMAN, Technical University of Cluj-Napoca
Gabriel VLĂDUŢ, Romanian Association for Technological Transfer and Innovation


International Advisory Body:

Karlheinz BOCK, TU Dresden, Electronics Packaging Lab IAVT, Dresden, Germany
Detlef BONFERT, Fraunhofer EMFT, Munich Germany
Joseph FJELSTAD, CEO of Verdant Electronics, USA
Zsolt ILLYEFALVI-VITEZ, University of Technology and Economics, Budapest, Hungary
Pavel MACH, Czech Technical University in Prague, Czech Republic
Alain MICHEL, ANSYS France
Jim MORRIS, Portland State University, Oregon USA
Andy SHAUGHNESSY, Managing Editor of The PCB Design Magazine and PCBDesign007, USA
Nihal SINNADURAI, IMAPS ELC Past President, U.K.
Heinz WOHLRABE, TU Dresden, Germany
Klaus-Jürgen WOLTER, TU Dresden, Germany


Technical Committee – Academic Trainers

Chairman:

Norocel CODREANU, Politehnica University of Bucharest

Co-Chairs:

Mihaela PANTAZICĂ, National University of Science and Technology POLITEHNICA of Bucharest
Liviu VIMAN, Technical University of Cluj-Napoca

Academic Members:

Mihaela ANDREI, Dunărea de Jos University of Galaţi
Constantin BARABAŞA, Gh. Asachi Technical University of Iaşi
Marius CARP, Transilvania University of Braşov
Emilian CEUCĂ, 1 Decembrie 1918 University of Alba Iulia
Mircea-Cătălin CONSTANTINESCU, University of Craiova
Mihai DĂRĂBAN, Technical University of Cluj-Napoca
Silviu EPURE, Dunărea de Jos University of Galaţi
Sanda-Diana FIRINCĂ, University of Craiova
Tecla GORAŞ, Gh. Asachi Technical University of Iaşi
Septimiu LICĂ, Politehnica University of Timişoara
Claudiu LUNG, Technical University of Cluj-Napoca, University Center of Baia Mare
Alin Gheorghiță MAZĂRE, National University of Science and Technology POLITEHNICA of Bucharest, University Center of Piteşti
Adrian PETRARIU, Ştefan cel Mare University of Suceava
Adrian ŞCHIOP, University of Oradea
Adrian TĂUT, Technical University of Cluj-Napoca


Industrial Committee

Chair:

Mihai CENUȘĂ, Continental Automotive, Iași

Industrial Co-Chair:

Bogdan POPESCU, Microchip Technology, Bucureşti

Industrial Members:

Alexandru AMARIEI, Continental Engineering Services, Timişoara
Gheorghe AMARIEI, Continental Engineering Services, Timişoara
Adrian BOSTAN, Microchip Technology, Bucureşti
Aurelian BOTĂU, Continental Automotive, Timişoara
Norbert BUCHMULLER, Robert BOSCH SRL
Valentin-Cătălin BURCIU, Draexlmaier Romania
Mihai BURGHEAUA, Continental Automotive, Iaşi
Iulian BUŞU, LUMPED Elements, Bucureşti
Florin DURUS, Robert BOSCH SRL
Mihai FEDOREAC, Continental Automotive, Timişoara
Alin GHENESCU, Continental Automotive Systems, Sibiu
Nicolae GROSS, Continental Automotive Systems, Sibiu
Florin HEREDEU, Plexus, Oradea
George LUCACI, Robert BOSCH SRL
Florin-Bogdan MARANCIUC, Continental Automotive Systems, Sibiu
Ionuţ-Alexandru MARIN, Continental Automotive Systems, Sibiu
Andrei NICORAŞ, Plexus, Oradea
Cosmin OBREJA, Vitesco Technologies Engineering Romania
Andras PARANICI, Vitesco Technologies Engineering Romania
Bogdan PICĂ, NTT DATA Romania, Cluj
Mariana POPÂRLAN, Vitesco Technologies Engineering, Sibiu
Alexandru-Gheorghiță RĂCHERU, Continental Automotive, Sibiu
Csaba TĂRCEAN, Continental Engineering Services, Timişoara
Bogdan-Iulian TELEGARIU, Vitesco Technologies Engineering, Sibiu
Corneliu TOMA, Digitech SRL, Bucureşti
Mihai VIDRAŞCU, Autonomous Flight Technology, Bucureşti
Roland VIG, Robert BOSCH SRL
Radu VOINA, KEYTEK Innovation, Alba Iulia

IEEE EPS Student Chapters Support Committee

Chair: Mădălin MOISE, IEEE-EPS, National University of Science and Technology POLITEHNICA of Bucharest

Co-Chair: Alin GRAMA, IEEE-EPS, Technical University of Cluj-Napoca, SBC Chair

Members:

Andreea DUMITRAȘCU, National University of Science and Technology POLITEHNICA of Bucharest
Anda JÂJÂIE, National University of Science and Technology POLITEHNICA of Bucharest
Cosmin ONCIOIU, National University of Science and Technology POLITEHNICA of Bucharest
Elena STETCO, Technical University of Cluj-Napoca


Technical secretariat

Chair: Delia LEPĂDATU, University Politehnica of Bucharest

Co-Chair:  Cristian PÎRVU, University of Craiova

Members:

Andreea IACOB, University of Craiova
Cristina LEPĂDATU, Association for Promoting Electronics Technology Bucharest
Bogdan MIHĂILESCU, National University of Science and Technology POLITEHNICA of Bucharest, APTE
Maria PĂTULEANU, National University of Science and Technology POLITEHNICA of Bucharest
Virginia RĂDULESCU, University of Craiova
Florentina STĂLINESCU, Association for Promoting Electronics Technology Bucharest


TIEPlus Steering Committee

Chairman:

Cătălin NEGREA, Continental Automotive, Timişoara

Co-Chairman:

Marcel MANOFU, Continental Automotive, Timişoara, Romania

Members:

Norocel CODREANU, University Politehnica of Bucharest
Cosmin MOISĂ, Continental Automotive, Timişoara
Dan PITICĂ, Technical University of Cluj-Napoca
Paul SVASTA, University Politehnica of Bucharest

 

Extended technical and scientific resources for TIE 2023 international design contest

Download PDF

Standards

IPC CHECKLIST for Producing Rigid PCBAs;
IPC-2221 – Generic Standard on Printed Board Design;
IPC-2222 – Sectional Design Standard for Rigid Organic Printed Boards;
IPC-2223 – Sectional Design Standard for Flexible Printed Boards;
IPC-7351 – Generic Requirements for Surface Mount Design and Land Pattern Standard;
IPC-2141 – Controlled Impedance Circuit Boards and High Speed Logic Design;
IPC-2581 – Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology;
IPC-4101 – Specification for Base Materials for Rigid and Multilayer Printed Boards;
IPC-6012 – Qualification and Performance Specification for Rigid PCBs;
IPC-7525 – Stencil Design Guidelines;
IPC-7527 – Requirements for Solder Paste Printing;
IPC-A-600 – Acceptability of Printed Boards.

Books

» Coombs C. F., Jr., “Printed circuits handbook” – 6th edition, McGraw Hill Professional, 1000 pp., 2007, ISBN 978-0071510790;
» Harper C. A., „Electronic packaging and interconnection handbook”, McGraw-Hill, 2000;
» Lau J., Wong C. P., Prince J. L., Nakayama W., „Electronic Packaging – Design, Materials, Process and Reliability”, McGraw-Hill, 1998;
» Johnson H., Graham M., „High-speed digital design, a handbook of black magic”, Prentice Hall PTR, New Jersey, 1993;
» Brooks D., „Signal Integrity Issues and Printed Circuit Board Design”, Prentice Hall PTR, 432 pp. 2003;
» Bogatin E., „Signal and Power Integrity – Simplified”, Prentice Hall, Boston, 2010.
» Jamnia A., „Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis”, 2nd edition, CRC Press, 2008;
» Harper C. A., „High Performance Printed Circuit Boards”, McGraw-Hill professional engineering, Professional Engineering, McGraw-Hill, 2000;
» Ulrich R. K., Brown W. D., „Advanced electronic packaging”, 2nd edition, IEEE Press – Wiley, 812 pp., 2006;
» Xingcun C. T., „Advanced Materials for Thermal Management of Electronic Packaging”, Springer Science & Business Media, 2011;
» Jin Y., Wang Z., Chen J., “Introduction to Microsystem Packaging Technology”, CRC Press, Boca Raton, 218 pp., 2011;
» Rohsenow W. M., Hartnett J. P., Cho Y. I., “Handbook of heat transfer”, McGraw-Hill, 1998;
» Ganesan S., Pecht M., “Lead-free Electronics”, John Wiley & Sons, New Jersey, 766 pp., 2006;
» Tummala R., Rymaszewski E. J., Klopfenstein A. G., „Microelectronics Packaging Handbook: Technology Drivers”, Part 1, Springer Science & Business Media, 2012.


<a href=”https://www.tie.ro/wp-content/uploads/2017/03/What-Design-Tool-to-use-for-TIE-Contest.pdf”>Download the presentation “What Design Tool to use for TIE Contest”</a> [PDF]