Relive the Highlights of TIE 2025!
The Technologies of Interconnections in Electronics (TIE) 2025 event brought together academia and industry representives active in electronic packaging. Over the course of several days, participants engaged in six thrilling competitions, showcasing their expertise and creativity in this dynamic field.
📽️ Watch the video now and relive the energy of TIE 2025!
Have a look at an interview with Dorin Antonovici, a former TIE-E participant that returned to the event as a company representative and TIE supporter.
View an interview with Marcel Manofu, the Chair of the TIE-E Plus Committee, industrial representative for Continental Automotive in Timișoara, Romania, shares his insights on the innovative practices in engineering education and the exciting challenges presented by the TIE-E Plus competition.
View an interview with Philip Coanda, Co-Chair of the TIE-M Committee, industrial representative for Continental Automotive Romania, shares his thoughts on the advancements in mechatronics and the impact of the TIE-M competition and TIE-T plus on thermal management.
Join us for a quick chat with Vlad Stanescu, an initiator of the TIE-M competition. Vlad shares his journey and the impact of his victory on his career in engineering.
