Relive the Highlights of TIE 2025!
The Technologies of Interconnections in Electronics (TIE) 2025 event brought together brilliant minds and cutting-edge innovations in electronic packaging. Over the course of several days, participants engaged in six thrilling competitions, showcasing their expertise and creativity in this dynamic field.
📽️ Watch the video now and relive the energy of TIE 2025!
Have a look at an interview with Dorin Antonovici, a former TIE-E participant that returned to the event as a company representative and TIE supporter.
View an interview with Marcel Manofu, the Chair of the TIE-E Plus Committee, industrial representative for Continental Automotive in Timișoara, Romania, shares his insights on the innovative practices in engineering education and the exciting challenges presented by the TIE-E Plus competition.
View an interview with Philip Coanda, Co-Chair of the TIE-M Committee, industrial representative for Continental Automotive Romania, shares his thoughts on the advancements in mechatronics and the impact of the TIE-M competition and TIE-T plus on thermal management.
Join us for a quick chat with Vlad Stanescu, an initiator of the TIE-M competition. Vlad shares his journey and the impact of his victory on his career in engineering.
