TIE micro 2026 COMMITTEES

TIE micro – Committee

 

Chair:

Dan MANOLESCU, 2D Photonics

Co-Chair:

Cătălin CIOBANU, Transilvania University of Braşov

International Modelling & Simulation Environment Coordinator

Raul FIZEȘAN, Technical University of Cluj-Napoca

Technical Committee – Academic Trainers

Chair:

Cătălin CIOBANU, Transilvania University of Braşov

Members:

Diana BRÎNARU, POLITEHNICA of Bucharest

Raul FIZEȘAN, Technical University of Cluj-Napoca

Aurel GONTEAN, Politehnica University of Timisoara

Daniela IONESCU, Gh. Asachi Technical University of Iaşi

Csaba Zoltán KERTÉSZ, Transilvania University of Braşov

Mihaela PANTAZICĂ, POLITEHNICA of Bucharest

Industrial Committee

Chair:

Dan MANOLESCU, 2D Photonics

Co-Chair:

Iosif ANTOCHI, NXP Romania

 Members:

Ciprian ABRAMOV, Microchip Technology București

Dorin ANTONOVICI, IFM Sibiu

Marcel MANOFU, AUMOVIO Technologies, Timișoara

Vladimir PAPIC – Cadence Design Systems

Mihai SAIN, Microchip Technology București

Ciprian VASILE, Association for Promoting Electronics Technology

Roxana VLĂDUȚĂ – Marvell Technology