TIE Contest – Extended technical and scientific references

Extended technical and scientific resources for TIE 2019 international design contest

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IPC CHECKLIST for Producing Rigid PCBAs;
IPC-2221 – Generic Standard on Printed Board Design;
IPC-2222 – Sectional Design Standard for Rigid Organic Printed Boards;
IPC-2223 – Sectional Design Standard for Flexible Printed Boards;
IPC-7351 – Generic Requirements for Surface Mount Design and Land Pattern Standard;
IPC-2141 – Controlled Impedance Circuit Boards and High Speed Logic Design;
IPC-2581 – Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology;
IPC-4101 – Specification for Base Materials for Rigid and Multilayer Printed Boards;
IPC-6012 – Qualification and Performance Specification for Rigid PCBs;
IPC-7525 – Stencil Design Guidelines;
IPC-7527 – Requirements for Solder Paste Printing;
IPC-A-600 – Acceptability of Printed Boards.


» Coombs C. F., Jr., “Printed circuits handbook” – 6th edition, McGraw Hill Professional, 1000 pp., 2007, ISBN 978-0071510790;
» Harper C. A., „Electronic packaging and interconnection handbook”, McGraw-Hill, 2000;
» Lau J., Wong C. P., Prince J. L., Nakayama W., „Electronic Packaging – Design, Materials, Process and Reliability”, McGraw-Hill, 1998;
» Johnson H., Graham M., „High-speed digital design, a handbook of black magic”, Prentice Hall PTR, New Jersey, 1993;
» Brooks D., „Signal Integrity Issues and Printed Circuit Board Design”, Prentice Hall PTR, 432 pp. 2003;
» Bogatin E., „Signal and Power Integrity – Simplified”, Prentice Hall, Boston, 2010.
» Jamnia A., „Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis”, 2nd edition, CRC Press, 2008;
» Harper C. A., „High Performance Printed Circuit Boards”, McGraw-Hill professional engineering, Professional Engineering, McGraw-Hill, 2000;
» Ulrich R. K., Brown W. D., „Advanced electronic packaging”, 2nd edition, IEEE Press – Wiley, 812 pp., 2006;
» Xingcun C. T., „Advanced Materials for Thermal Management of Electronic Packaging”, Springer Science & Business Media, 2011;
» Jin Y., Wang Z., Chen J., “Introduction to Microsystem Packaging Technology”, CRC Press, Boca Raton, 218 pp., 2011;
» Rohsenow W. M., Hartnett J. P., Cho Y. I., “Handbook of heat transfer”, McGraw-Hill, 1998;
» Ganesan S., Pecht M., “Lead-free Electronics”, John Wiley & Sons, New Jersey, 766 pp., 2006;
» Tummala R., Rymaszewski E. J., Klopfenstein A. G., „Microelectronics Packaging Handbook: Technology Drivers”, Part 1, Springer Science & Business Media, 2012.