STUDENTS INNOVATION CHALLENGE

Innovative Application of Advanced Packaging in Microelectronics

📣 It is our pleasure to announce a students competition for the upcoming 75th anniversary ECTS conference that will be held between May 27-30, 2025 at Gaylord Texan resort & Convention Center, Dallas, TX, USA.

🏆 This is a great chance for you to showcase your skills, present your innovative ideas and compete with other students from all around the world.

TIE-T Plus -Thermal

Thermal management optimization is an iterative process that requires multiple rounds of simulation, testing, and refinement. As new components or cooling technologies are introduced, the thermal management system must be continuously evaluated and optimized to ensure it can handle the evolving heat loads and maintain the desired performance and efficiency targets.

Choosing the most appropriate cooling method, such as active or passive cooling, is key to optimizing thermal performance. Simulation and modeling can help engineers evaluate the effectiveness of different cooling solutions and select the most suitable approach for their specific application.

Simulation and modeling can help evaluate and refine initial thermal management concepts. By virtually testing different design ideas, engineers can identify the most promising approaches and make informed decisions before investing in physical prototypes, leading to a more efficient and cost-effective design process. As computational power and algorithm sophistication improve, engineers will have access to more advanced tools to tackle increasingly complex thermal management challenges.

The Role of Simulation and Modeling

Predictive Capabilities

Simulation and modeling allow engineers to predict thermal behavior and identify potential hot spots before physical prototyping. By virtually testing various design scenarios, engineers can gain valuable insights into the thermal performance of their systems, enabling them to make informed decisions and optimize the design before investing in physical hardware.Optimization Opportunities

These simulation and modeling tools enable designers to explore a wide range of design options and find the most optimal thermal management solutions. By comparing the thermal performance of different cooling techniques, component placements, and airflow patterns, engineers can identify the most efficient and cost-effective approach to maintain the desired operating temperatures within their electronic devices.

Reduced Costs

Simulation and modeling can significantly reduce the need for costly physical testing and iterations. By identifying and resolving potential thermal issues early in the design process, engineers can minimize the number of physical prototypes required, saving time and resources. This approach allows for a more streamlined and efficient product development cycle, ultimately leading to faster time-to-market and reduced overall costs.

Integrated Multiphysics

The integration of thermal management with other physical domains, such as electromagnetics and structural mechanics, will become increasingly important. By considering the interactions between these different phenomena, engineers can develop a more comprehensive understanding of the system’s behavior and optimize its performance more effectively.

Cristina Mihaela Dragan, Continental Automotive Romania

Ciprian Ionescu, POLITEHNICA Bucharest, Romania

TIE_2024_Brochure

Industrial Advisor Committees of TIE 2024 would like to congratulate all participants.

TIE-E Classification

TIE-Eplus Classification

TIE-Tplus Classification

TIE-^µ Classification

TIE-Mplus Classification

TIE-M Classification

TIE-M -Mechanical

TIE M-Mechanical is a CAD Design Challenge that aims to assess students’ proficiency in computer-aided design (CAD) for mechanical components, with a focus on electronic packaging and electro-mechanical assembly as shown in Figure 1. This challenge evaluates students’ knowledge and skills acquired through coursework in mechanical engineering, emphasizing the design and manufacturing of mechanical components using CAD software. The challenge seeks to establish itself as a benchmark certification in the field of mechanical CAD design, particularly within the context of electronic packaging and electro-mechanical systems.

Figure 1. Electro-mechanical assembly

Objectives:

– Stimulating student’s interest in mechanical engineering and CAD design, particularly in the context of electronic packaging and electro-mechanical assembly.

– Evaluating student’s CAD design skills within a competitive framework, fostering a spirit of excellence and innovation in mechanical component design for electronic systems.

– Certifying student’s CAD proficiency endorsed by industry experts, including the Industrial -Advisory Committee (IAC), to meet industry standards and requirements for electronic packaging and electro-mechanical assembly.

– Providing the electronics industry with a pool of skilled CAD designers ready to contribute to various electro-mechanical engineering projects, including electronic packaging solutions.

– Familiarizing students with the processes involved in designing mechanical components and assemblies for electronic packaging, ensuring compatibility with electronic modules and adherence to packaging standards.

– Cultivating a high level of professionalism in the use of CAD software systems for mechanical engineering applications in the context of electronic packaging and electro-mechanical assembly.

– Increasing awareness within the mechanical engineering and electronics industries about available talent and fostering strong partnerships between academia and industry in the realm of electro-mechanical engineering.

– Generating increased demand for mechanical engineers with CAD design skills specialized in electronic packaging and electro-mechanical assembly among current students and expanding job opportunities within the industrial sector.

Description of a subject (summary)

As a mechanical design engineer, your company won a project to create a sensor module for a well know OEM car manufacturer. To boost profits and speed up development, the company chose to use existing components (Figure 2) and make design ajustments to meet the client’s needs. Modifications to the bracket and sensor ensure they fit within specified areas without altering overall functionality. The client provided a 2D drawing (“Cover.pdf”) as a starting point for the cover design, which must be optimized to meet all requirements. The 3D model includes restricted areas for the new parts.

Figure 2 Existing components

Solution

The criteria on the basis of which the student qualifies as being initiated in the evaluated topic:

– Understanding Electronic Packaging: Show knowledge of how to place electronic components and manage heat within CAD designs.

– Efficient Component Integration: Ability to seamlessly integrate electronic parts into mechanical designs while meeting industry standards.

– CAD Proficiency: Expertise in using CAD software to design, model, and simulate electronic assemblies.

– Creative Problem-Solving: Demonstrate innovative solutions to electronic packaging challenges within CAD designs.

– Detail-Oriented Design: Attention to detail in CAD designs, including precision in measurements, accurate placement of components, and consideration of assembly constraints and tolerances for electronic packaging.

– Compliance with Standards: Ensure that CAD designs meet industry standards and client requirements.

– Clear Communication: Clearly convey design intentions through CAD drawings and documentation for effective collaboration.

– Professionalism: Maintain professionalism by meeting deadlines, accepting feedback, and handling information ethically.

TIE_µ  Committees

Chair:

Dan MANOLESCU, Marvell Technology

Co-Chair:

Cătălin CIOBANU, Transilvania University of Braşov

Technical Committee – Academic Trainers

Chair: Cătălin CIOBANU, Transilvania University of Braşov

Members:

Marius CARP, Transilvania University of Braşov

Daniela IONESCU, Gh. Asachi Technical University of Iaşi

Ksaba KERTESZ, Transilvania University of Braşov

Dan NICULA, Transilvania University of Braşov

Mihaela PANTAZICĂ, POLITEHNICA of Bucharest

Industrial Committee

Chair: Dan Manolescu, Marvell Technology

Co-Chair: Roxana Vladuță, Marvell Technology

Members:

Luciana Chitu, Marvell Technology

Eduard Popa, Marvell Technology

TIE Tplus  Committees

Chair:

Cristina Mihaela DRĂGAN, Continental Automotive Romania, Timișoara

Co-Chair:

Philip COANDĂ, Continental Automotive Romania, Timișoara

Technical Committee – Academic Trainers

Chair:

Ciprian IONESCU, Politehnica Bucharest, Romania

Members:

Cristian FĂRCAŞ, Technical University of Cluj Napoca

Zeno-Iosif PRAISACH, Babeș-Bolyai University Cluj-Napoca

Dorin LELEA, University Politehnica of Timisoara

Industrial Committee

Chair:

Constantin POPESCU, Continental Autonomous Mobility

Industrial Members:

Aurelian BOTAU, Continental Automotive Romania

Eugen DINCA, Continental Automotive Romania

Lucian BODIN, Continental Autonomous Mobility Timișoara

Razvan STANCA, INAS SA Craiova

TIE_E Committees

Chair:

Liviu VIMAN, Technical University of Cluj-Napoca

Co-Chairs:

Mihaela PANTAZICĂ, POLITEHNICA of Bucharest

Technical Committee – Academic Trainers

Chair:

Liviu VIMAN, Technical University of Cluj-Napoca

Co-Chairs:

Mihaela PANTAZICĂ, POLITEHNICA of Bucharest

Academic Members:

Alexandru AVRAM, 1 Decembrie 1918 University of Alba Iulia

Iulian BOULEANU, Lucian Blaga University of Sibiu

Marius CARP, Transilvania University of Braşov

Mihai DĂRĂBAN, Technical University of Cluj-Napoca

Silviu EPURE, Dunărea de Jos University of Galaţi

Sanda-Diana FIRINCĂ, University of Craiova

Daniela IONESCU, Gh. Asachi Technical University of Iaşi

Septimiu LICĂ, Politehnica University of Timişoara

Cristian Marius LUPOU, Politehnica University of Timişoara

Alin Gheorghiță MAZĂRE, POLITEHNICA of Bucharest, University Center of Piteşti

Mădălin MOISE, POLITEHNICA of Bucharest

Mihai NEGHINĂ, Lucian Blaga University of Sibiu

Adrian PETRARIU, Ştefan cel Mare University of Suceava

Industrial Committee

Chair:

Mihai CENUȘĂ, Continental Automotive, Iași

Industrial Co-Chair:

Bogdan POPESCU, Microchip Technology, Bucureşti

Roland VIG, Robert BOSCH SRL

Academic Co-Chair:

Gabriel CHINDRIŞ, Technical University of Cluj-Napoca

Industrial Members:

Aurelian BOTĂU, Continental Automotive, Timişoara

Norbert BUCHMULLER, Robert BOSCH SRL

Valentin-Cătălin BURCIU, Draexlmaier Romania

Iulian BUŞU, LUMPED Elements, Bucureşti

Alexandru CHISER, Microchip Technology, Bucureşti

Mugur DOBRE, Akkodis Munich, Germania

Florin Alexandru DURUS, Robert BOSCH SRL

Alexandru EFROS, Continental Automotive Systems, Sibiu

Nicolae GROSS, Continental Automotive Systems, Sibiu

Alexandru KNIZEL, Continental Automotive, Timişoara

George LUCACI, Robert BOSCH SRL

Florin-Bogdan MARANCIUC, Continental Automotive Systems, Sibiu

Marian-Călin NEMEȘ, Continental Automotive Systems, Sibiu

Flaviu NISTOR, Continental Automotive Systems, Sibiu

Costin ONOFREI, Robert BOSCH SRL

Csaba TĂRCEAN, Continental Engineering Services, Timişoara

Corneliu TOMA, Digitech SRL, Bucureşti

Mihai VIDRAŞCU, Autonomous Flight Technology, Bucureşti

Radu VOINA, KEYTEK Innovation, Alba Iulia

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TIE 2024  – BROCHURE AND ADVANCED PROGRAMME [Download PDF]

Recommendations for accommodation for TIE 2024 Participants

Dear TIE Participants,

Please take into consideration the following information about the TIE 2024 Accomodation:

CITY: Sibiu, Romania

Accomodation:

MyContinental Hotel, Calea Dumbrăvii 2-4, Sibiu

The rates per night with breakfast included, with TIE2024 code are:

*** In order to benefit from these rates, you must make the reservation by phone at the hotel or through Delia Lepadatu.

The contact person for accommodation of the participants:
– Name: Delia LEPĂDATU
– E-mail:delia.l@cetti.ro

We are looking forward in meeting you in Sibiu at TIE 2024!

TIE-M Plus: Accept the Structural Challenge

Finite element analysis (FEA) is a numerical method used for predicting how an object or an assembly behaves under given physical conditions.

It is necessary to use mathematics to comprehensively understand and quantify any physical phenomena such as solid mechanics, fluid mechanics, electromagnetics, heat transfer, acoustics, or other physical effects.

Most of these phenomena are described using Partial Differential Equations (PDEs). Solving these PDEs, even by using computational methods, required the development of specific numerical techniques over the last few decades, out of which a prominent one is the FEA.

Engineers in various industries heavily rely on FEA, because of its benefits including increased accuracy of prediction, better insight into critical design parameters, virtual prototyping, fewer hardware prototypes and experimental validations, a faster and less expensive design cycle, increased productivity, and, overall, an increased revenue.

Starting from 2023, TIE introduced a new section called TIE-M+, focusing on structural and thermal management analysis of electronic packaging. The contest provides students with a comprehensive electronics development experience concerning structural integrity aspects.

Picture 1 – Example of a product chosen for the simulation contest

Organizing such a FEA competition in Romania helps to fill the gap in a multidisciplinary contest, offers an opportunity for students to relate their theoretical knowledge to practical examples, and helps to bring together specialists and experts from the industrial and academical partners.

The subjects the students must develop are focusing on different types of electronic modules, such as particular control units or sensors, coming from the forefront of the automotive industry, including business areas like Architecture and Networking or Autonomous Driving.

The goal is to have the students understand the product and its weak spots, properly design a path towards its numerical evaluation (e.g., PCB deformation, natural frequency, and mode shape analysis) and give recommendations for design optimizations to improve system performance.

The general objective of the structural simulation contest is to familiarize the students to the basic knowledge regarding numerical simulations. In addition to this, a specific objective is to familiarize the contestants to the state-of-the-art practical workflows used within industry, to prepare the future engineers for a career in the structural simulation field.

Picture 2 – Numerical model and the corresponding subjects required