• TIE 2026 Events
  • TIE 2026 PROMOTIONAL POSTER
  • TIE 2026 – BROCHURE AND ADVANCED PROGRAMME
  • TIE 2026 CLASSIFICATION
  • TIE 2026 Program
  • TIE 2026 Registration Forms
  • TIE 2026 POSTERS
  • TIE 2026 PARTNERS – SPONSORS – TECHNICAL SPONSORS
  • TIE-E 2026
    • TIE-E Contest Regulation
    • TIE E Committees
    • TIE-E Contest – Extended technical and scientific references
  • TIE-E plus 2026
    • TIE – E Plus Contest Regulation
    • TIE-E Plus 2026 COMMITTEES
  • TIE-M 2026
    • TIE – M Concept
    • TIE-M 2026 COMMITTEES
  • TIE-M plus 2026
    • TIE – M Plus Concept
    • TIE-M Plus 2026 COMMITTEES
  • TIE-T plus 2026
    • TIE – T Plus Concept
    • TIE-T Plus 2026 COMMITTEES
  • TIE-µ 2026
    • TIE u (micro) Concept
    • TIE micro 2026 COMMITTEES
  • TIE-n 2026
    • TIEn CONCEPT
    • TIEn 2026 COMMITTEES
• Sponsors
  • TIE 2026 PARTNERS – SPONSORS – TECHNICAL SPONSORS
• Previous editions
  • TIE 2025 Events
    • TIE 2025 PROMOTIONAL POSTER
    • TIE 2025 – BROCHURE AND ADVANCED PROGRAMME
    • TIE 2025 PARTNERS – SPONSORS – TECHNICAL SPONSORS
    • TIE 2025 & Microelectronics Day Venue
    • TIE 2025 Programme
    • TIE 2025 CLASSIFICATION
    • TIE-E 2025
      • TIE-E Concept
      • TIE E 2025 PROMOTIONAL POSTER
      • TIE-E Contest Regulation
      • TIE-E Contest – Extended technical and scientific references
      • TIE E Committees
    • TIE-E plus 2025
      • TIE-Eplus Concept
      • TIE E Plus 2025 PROMOTIONAL POSTER
      • TIE – E Plus Contest Regulation
      • Past Editions Subjects
    • TIE-M 2025
      • TIE – M Concept
      • TIE_M 2025 PROMOTIONAL POSTER
    • TIE-T plus 2025
      • TIE – T Plus Concept
      • TIE_T Plus 2025 PROMOTIONAL POSTER
    • TIE-M plus 2025
      • TIE – M Plus Concept
      • TIE_M Plus 2025 PROMOTIONAL POSTER
    • TIE-µ 2025
      • TIE u (micro) Concept
      • TIE micro 2025 PROMOTIONAL POSTER
      • TIE micro 2025 COMMITTEES
  • TIE 2024
    • TIE Events 2024 PROMOTIONAL POSTER
    • TIE 2024 CLASSIFICATION
    • TIE-E 2024
      • TIE-E Concept
      • TIE-E Contest Regulation
      • TIE-E Contest – Extended technical and scientific references
      • EVENT COMMITTEES TIE 2024
    • TIE-E plus 2024
      • TIE – E Plus Contest Regulation
      • TIEplus 2024 Edition
      • TIEplus 2024 PROMOTIONAL POSTER
      • TIE-E plus Committees
      • Photo Gallery TIE PLUS
    • TIE_M 2024
      • TIE – M Concept
      • TIE_M 2024 PROMOTIONAL POSTER
      • EVENT COMMITTEES TIE-M & TIE-M Plus 2024
    • TIE-T plus 2024
      • TIE – T Plus Concept
      • TIE-T Plus 2024 PROMOTIONAL POSTER
      • TIE Tplus Committees
    • TIE-M plus 2024
      • TIE – M Plus Concept
      • TIE_M Plus 2024 PROMOTIONAL POSTER
      • EVENT COMMITTEES TIE-M & TIE-M Plus 2024
    • TIE-µ 1st Edition 2024
      • TIE u (micro) Concept
      • TIE µ 2024 PROMOTIONAL POSTER
      • TIE µ Committees
    • TIE 2024 – BROCHURE AND ADVANCED PROGRAMME
    • TIE 2024 Programme
  • TIE 2023
    • ELECTRONIC WEEK 2023 – BROCHURE AND ADVANCED PROGRAMME
    • Electronic Week 2023 – Program
    • TIE-E 2023
      • EVENT COMMITTEES TIE-E 2023
      • TIE-E 2023 PROMOTIONAL POSTER
      • TIE 2023 CLASSIFICATION
    • TIE-Eplus
      • TIE-Eplus 2023 PROMOTIONAL POSTER
    • TIE_M 2023
      • EVENT COMMITTEES TIE-M 2023
      • TIE_M 2023 PROMOTIONAL POSTER
      • TIE_M 2022 PROMOTIONAL POSTER
    • TIE 2023 & TIE M Venue for Students
  • TIE 2022
    • EVENT COMMITTEES TIE 2022
    • TIE 2022 PARTNERS – TECHNICAL SPONSORS – SPONSORS
    • TIE Contest – Extended technical and scientific references
    • What Design Tool to use for TIE Contest
    • TIE Contest Regulation
    • TIE Concept
  • TIE 2021
    • TIE & TIE Plus 2021 – Schedule & Microsoft Teams links
    • Electronic Week 2021 – Program
    • ELECTRONIC WEEK 2021 – BROCHURE AND ADVANCED PROGRAMME
    • TIE 2021 PARTNERS – TECHNICAL SPONSORS – SPONSORS
    • EVENT COMMITTEES TIE 2021
  • TIE 2020
    • TIE Contest Subjects
    • About TIE 2020 Organizer – UPB
    • Electronic Week 2020 – Brochure and Advanced Programme
    • TIE2020 Promotional Poster
    • TIE 2020 PARTNERS – TECHNICAL SPONSORS – SPONSORS
    • EVENT COMMITTEES TIE 2020
  • TIE 2019
    • TIE 2019 Classification
    • Photo Gallery TIE 2019
    • TIE 2019 Brochure
    • TIE 2019 Venue
    • TIE2019 part of EU CLUSTER WEEKS
    • Final Program – TIE & TIEplus 2019
    • TIE 2019 PARTNERS – TECHNICAL SPONSORS – SPONSORS
    • EVENT COMMITTEES TIE 2019
  • TIE 2018
    • Presentation video of TIE 2018 and TIEplus 2018
    • Photo Gallery TIE 2018
    • Program – TIE & TIEplus 2018
    • TIE 2018 Brochure
    • TIE 2018 Promotional POSTER
    • TIE 2018 Promotional Flyer
    • TIE 2018 PARTNERS – TECHNICAL SPONSORS – SPONSORS
    • TIE 2018 Classification
    • Event Committees TIE 2018
    • Workshop TIE 2018
      • Agenda Workshop TIE 2018
      • Poster Worskhop TIE 2018
  • TIE 2017
    • Program – TIE & TIEplus 2017
    • TIE 2017 Brochure
    • TIE 2017 Promotional POSTER
    • TIE 2017 Classification
    • Photo Gallery TIE 2017
    • TIE 2017 PARTNERS AND TECHNICAL SPONSORS
    • What Design Tool to use for TIE Contest
    • Workshop TIE 2017
      • WORSKHOP HR – TIE 2017 – Agenda
  • TIE 2016
    • What Design Tool to use for TIE Contest
    • TIE 2016 Classification
    • Photo Gallery TIE 2016
    • TIE 2016 Brochure
    • Contest Regulation TIE2016
    • TIE 2016 Promotional POSTER
    • Event Committees TIE 2016
    • Workshop TIE 2016
      • WORKSHOP TIE 2016 – Program and presentations
  • TIE 2015
    • Photo Gallery TIE 2015
    • TIE 2015 Brochure
    • TIE 2015 Classification
    • TIE 2015 Partners and Sponsors
    • TIE 2015 Promotional POSTER
    • Contest Regulation TIE2015
    • Event Committees TIE 2015
    • Workshop TIE 2015
      • Workshop TIE 2015 Program
  • TIE2014
    • Photo Gallery TIE 2014
    • TIE 2014 Classification
    • TIE 2014 Brochure
    • Program TIE 2014
    • TIE 2014 Partners and Technical Sponsors
    • TIE 2014 Professional Student Contest 23rd Edition, 9-12 April 2014, Timisoara, Romania
    • Event Committees
    • Location (Timisoara)
    • Workshop TIE 2014
      • Workshop TIE 2014 Program
  • TIE2013
    • TIE 2013 Program
    • Contest Regulations
    • Event Committees 2013
    • TIE Topics
    • Location (Brasov)
    • Event location and directions
    • TIE Poster
    • Program Brochure
    • TIE Classification (2011-2013)
    • Photo Gallery TIE2013
    • Sponsors
    • Contact
    • Workshop TIE 2013
      • WORKSHOP TIE 2013 – Program and presentations
      • Photo Gallery Workshop AMEEP
  • TIE2012
    • Contest Regulations
    • Datasheets and documents
    • Event Committees
    • General Program
    • Program Brochure
    • Classification
    • Classification (IAC)
    • TIE2012 Sponsors
    • Comunicat APDETIC: Campania eSkills Week 2012
    • TIE local stages
    • Topics
    • Workshop TIE 2012
      • Workshop “UP TO DATE ISSUES IN ELECTRONIC ASSEMBLING TECHNOLOGIES” 26 April 2012
      • Workshop Presentations
      • Workshop – Photo Gallery
  • TIE2011
    • Contest
    • Contest and documents
    • Event Committees
      • Organizing Committee
      • IEEE Romania Section
      • Industrial advisor committee
      • Steering committee
      • Student Committee
      • Technical committee
    • Final Program
    • International Workshop on Electronics Technology – Workshop “Fii intreprinzator”
    • Photos
    • Program
    • Regulament [RO]
    • Regulations [EN]
    • Student professional contest The XXth Edition, Bucharest, 13th-16th April 2011
    • Workshop TIE 2011
      • International Workshop on Electronics Technology
      • Agenda 2011
      • Photos: International Workshop AMEEP
  • TIE Workshops
    • Program workshop ELAN IN CADRUL TIE 2010 [RO]
      • Workshop 2010 – Photo Gallery
    • Workshop TIE 2009
      • Workshop 2009 – Photo Gallery
    • Workshop 2008 – Photo Gallery
    • Workshop 2004 – Photo Gallery
• Press Release
  • PCBDesign007: Romania’s PCB Design Students Compete at TIE 2017
  • CST Supports the 2017 TIE+ PCB Design Simulation Contest
  • The PCB Design Magazine – April 2017 – TIE 2017
  • Press Release – TIE 2016 PROFESSIONAL STUDENT CONTEST
  • Press Release – TIE 2014 Professional Student Contest
  • (TIE2012 – Plus Magazine – Aug 2012) Layouter Nachwuchs – wie kann man ihn optimal fordern? – Ein blick nach Rumänien
  • (FED Conference Presentation – 22 September 2012) REQUIREMENTS OF INDUSTRY FOR THE EDUCATION OF PRINTED CIRCUIT BOARD DESIGNERS
  • 2010 – Interconnection Techniques in Electronics (TIE)
  • 2010 – TIE shows the way forward using CAD techiques for electronics
  • 2010 – An excellent CPMT Region 8 event (CPMT Hungary and Romania): TIE Galati, Romania.
  • 2010 – TIE Event – Students’ Contest
  • 15th International Symposium for Design and Technology of Electronics Packages – SIITME 2009
• Contact

tie2010_1

• TIE – Industry-wide Student Challenges
  • TIE-E Concept
  • TIE – E Plus Contest Regulation
  • TIE-E Contest Regulation
  • TIE – M Concept
  • TIE – M Plus Concept
  • TIE – T Plus Concept
  • TIE u (micro) Concept
  • What Design Tool to use for TIE -E Contest
  • TIE Contest Subjects
  • TIE-E Contest – Extended technical and scientific references
• TIE 2025 Edition
  • Highlights of TIE 2025
  • TIE 2025 CLASSIFICATION
  • TIE 2025 PARTNERS – SPONSORS – TECHNICAL SPONSORS
  • TIE 2025 PROMOTIONAL POSTER
  • EVENT COMMITTEES TIE 2025
  • TIE E Committees
  • TIE-M 2025 COMMITTEES
  • TIE-E Plus 2025 COMMITTEES
  • TIE-T Plus 2025 COMMITTEES
  • TIE micro 2025 COMMITTEES