TIE – Eplus Past Editions Subjects
This page contains the TIE-Eplus subject for the past editions.
This will allow you to analyze the difficulty of the subjects and prepare for the upcoming TIE-Eplus challenges.
2023: The diagram below describes the simplified architecture of a System-on-Module PCB that is based on an ARM-Cortex SoC
The subject information for the TIE-Eplus 2023 edition is available in the PDF file below.
2020: Design the electrical connections within the Light-Control Engine and Picture-Projection of an Augmented Reality Headset System
The subject information for the TIE-Eplus 2020 edition is available in the PDF file below.
Full subject archive:
TIE-Eplus 2020 Subject archive
2019: Design of the power distribution network for the Image Sensor Board of a Space Cube Satellite PCB
The subject information for the TIE-Eplus 2019 edition is available in the PDF file below.
Full subject archive:
TIE-Eplus 2019 Subject archive
2018: Signal Integrity Analysis of a FPGA graphic accelerator card
The subject information for the TIE-Eplus 2018 edition is available in the PDF file below.
Full subject archive:
TIE-Eplus 2018 Subject archive
2017: Power Integrity Analysis of a DDR3 interface supply rail
The subject information for the TIE-Eplus 2017 edition is available in the PDF file below.
Full subject archive:
TIE-Eplus 2017 Subject archive
2015:Signal Integrity Analysis of a differential RSDS channel
The subject information for the TIE-Eplus 2015 edition is available in the PDF file below.
Full subject archive (with modeling information):
