TIE+ Topics


The TIE+ subject of the 2021 edition will be focused on the simulation for signal and power integrity of electronic assemblies (single board and multi-board systems).


Topics for 2021 subject

This year’s subject will involve know-how from the following areas:

> Signal integrity simulation of differential transmission lines and LVDS channel requirements

> Definition of power distribution network requirements and design of decoupling network; typical power integrity simulation flow based on target impedance definition

> SPICE (or other circuit simulator) based thermal simulation using electro-thermal analogies; resistor network based thermal modeling


The need to incorporate such specialized electromagnetic simulations in to the PCB design flow is determined by the fact that, at high frequencies associated with digital data transmissions, the interconnect can be no longer considered an ideal electrical connection and the parasitic elements have to be taken in to consideration.

A general overview of the topics of interest for this disciplinary area is provided below.

> Transmission line theory
— Line impedance
— Propagation delay
— Reflections

> Single ended and differential data transmissions
— Terminations
— Eye diagrams
— Routing topologies

> Crosstalk
— Coupling mechanisms
— Near-End and Far-End crosstalk
— Crosstalk induced ISI

> IC modeling for SI simulations
— IBIS Modeling
— I\O buffer impedance analysis
— Package parasitics modeling

> Passive components & interconnect modeling
— S-parameters
— Touchstone modeling
— Capacitor modeling
— Via hole modeling
— 2D\3D Field solver extraction

> PCB Stack-up definition
— PCB material properties
— PCB build-up process
— Technology limitations
— IPC design recommendations

> Timing analysis
— Interface timing budget planning
— Interconnect propagation delays
— Jitter characterization

> Power Integrity of digital circuits
— Decoupling capacitor modeling
— Power nets/ plane parasitic modeling
— IR Drop Analysis
— Target Impedance definition for digital circuits
— AC domain analysis of decoupling networks
— Transient analysis of power line switching noise
— Power Distribution Network (PDN) Impedance analysis

> Signal and Power Integrity dependence

> Interconnect modeling techniques

> Electromagnetic field solvers

> Signal & Power Integrity simulations tools

> Thermal modeling
— Electro-thermal analogies
— Heat transfer basics: conduction / convection / radiation
— SPICE modeling of thermal circuits
— Compact modeling
— Steady state and transient simulation with compact models

Recommended Bibliography

— Signal Integrity Issues and Printed Circuit Board Design, Douglas Brooks, Prentice Hall PTR
— High-Speed Digital Design “A handbook of Black Magic”, H. W. Johnson, Prentice Hall PTR
— High-Speed Circuit Board Signal Integrity, Stephen C. Thierauf, Artech House
— Advanced Signal Integrity for High-Speed Digital Designs, Stephen Hall, Howard Heck,  IEEE-Wiley, 2009.
— Frequency Domain Characterization of Power Distribution Networks, Istvan Novak, Jason R. Miller, Artech House, Boston, 2007.
— Signal Integrity – Simplified, Eric Bogatin, Prentice Hall, New Jersey, 2004.
— Signal Integrity Characterization Techniques, Mike Resso, Eric Bogatin, IEC, 2009.
— Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages, Brian Young, Prentice Hall, 2000.
— Timing Analysis and Simulation for Signal Integrity Engineers, Greg Edlund, Prentice Hall, 2007.
— Principles of Power Integrity for PDN Design: Robust and Cost Effective Design for High Speed Digital Products, Larry D Smith, Eric Bogatin, Prentice Hall 2017
— Right the First Time: a Practical Handbook on High Speed Pcb and System Design, Lee W. Ritchey, John Zasio, Speeding Edge 2003
— Power Distribution Network Design Methodologies, Istvan Novak
— Frequency-domain Characterization of Power Distribution Networks, , Istvan Novak
— Thermal Design of Electronic Equipment, Ralph Remsburg
— A Heat Transfer Textbook, John H. Lienhard
— Thermal Considerations for Surface Mount Layouts, Texas Instruments application note
— Thermal Management Handbook for Electronic Assemblies, A. Krum J. Sergent,
— Power Integrity: Measuring, Optimizing and Troubleshooting Power Related Parameters in Electronics Systems, Steven M. Sandler


Simulation Tools                                                                                                                           

This is a list of the recommended simulation environments, which are widely used in the field of SI/PI simulations, however the usage of other simulation tools is not restricted. 

1. ANSYS EM Suite
    required applications: SI Wave, HFSS, DesignerSI = Electronics Desktop

   Training material:
   additional info:
   — a free trial is available upon request by your university coordinator
   — an extended series of training materials are available through the Customer Portal; contact your university coordinator  for login information
   — a set of ANSYS tutorials are available here 

2. Keysight ADS (Advanced Design System)

  Required packages:
  — W2360EP SIPro Signal Integrity EM Analysis Element
  — W2359EP PIPro Power Integrity EM Analysis Element
  a full trial version is available online after registration

3. Hyperlynx (Mentor Graphics)
  required applications: Linesim (with PI capability), BoardSim; minimum version 8.1

  Training material:

4. CST (Computer Simulation Technology)

  required applications:  Design Studio, PCB Studio, Microwave Studio; minimum version 2014

  Training material:

  additional info:
  — a free trial is available upon request by your university coordinator
 — the CST online webinar from the 6th of April / 2017 is available here

5. Allegro Sigrity (Cadence)
  required applications: Allegro Sigrity SI Base + Power Aware SI option

6. ALTERA PDN Design spreadsheet